TT Electronics/IRC

GS7B0166R5JDT

GS7B0166R5JDT Description

The GS7B0166R5JDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Housed in a 14-pin narrow SOIC package, this bussed network integrates 13 thin-film resistors with a 66.5Ω resistance value and a ±5% absolute tolerance. Its ±100ppm/°C temperature coefficient ensures stable performance across a wide operating range of -55°C to +125°C, with derated power handling up to 125°C. The 0.05W (1/20) power rating per resistor and 0.7W total power rating make it suitable for low-power, high-density designs.

GS7B0166R5JDT Features

• Robust Construction: Ceramic substrate and gull-wing termination provide mechanical durability and reliable surface-mount compatibility.
• Precision Performance: ±0.5% ratio tolerance ensures consistent matching for critical analog/digital signal conditioning.
• Space-Efficient: Compact 8.66mm × 5.99mm × 1.45mm footprint with 1.27mm terminal pitch optimizes PCB real estate.
• High Voltage Handling: Supports up to 100V maximum voltage, ideal for industrial and automotive-grade applications (though not PPAP/automotive-certified).
• Stable Thermal Characteristics: Thin-film technology minimizes resistance drift under thermal stress.

GS7B0166R5JDT Applications

• Signal Conditioning: Precision voltage dividers in sensor interfaces and ADC/DAC circuits.
• Bus Termination: Effective for I²C, SPI, or CAN bus networks requiring matched impedance.
• Industrial Controls: Reliable performance in PLCs, motor drives, and power management systems.
• Test & Measurement Equipment: Low-noise, stable resistance for calibration and instrumentation.
• Consumer Electronics: Space-constrained designs like wearables or IoT devices benefit from its integration density.

Conclusion of GS7B0166R5JDT

The GS7B0166R5JDT excels in applications demanding tight tolerance, thermal stability, and compact form factors. While not RoHS-compliant or automotive-qualified, its ceramic construction, bussed architecture, and thin-film precision make it a standout choice for industrial and embedded systems. Engineers will appreciate its balance of performance, reliability, and space savings in complex circuit designs.