TT Electronics/IRC

GS7B016810FDT

GS7B016810FDT Description

The GS7B016810FDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 14-pin narrow SOIC package features 13 bussed resistors, each with a 681Ω resistance and a tight ±1% absolute tolerance, ensuring consistent performance. The thin-film technology delivers excellent stability with a ±100ppm/°C temperature coefficient, making it suitable for environments with fluctuating temperatures. Rated for 0.05W (1/20) per resistor and 0.7W total power dissipation, it operates reliably within a 70°C to 125°C derated power range, with a maximum operating temperature of 125°C. Its 100V maximum voltage rating and 1.27mm terminal pitch facilitate integration into compact, high-density designs.

GS7B016810FDT Features

• Ceramic SOIC-C Series: Robust construction with rectangular package shape (8.66mm x 5.99mm x 1.45mm) and gull-wing termination for secure surface mounting.
• Precision Performance: ±0.5% ratio tolerance and ±1% absolute tolerance ensure accuracy in signal conditioning and voltage division.
• Thermal Stability: ±100ppm/°C TCR minimizes resistance drift across a wide -55°C to +125°C range.
• High-Density Design: 14-pin narrow SOIC with 13 bussed resistors optimizes space in multi-channel applications.
• Reliable Power Handling: 0.7W total power rating and 100V max voltage support industrial and automotive-grade requirements (though not PPAP or Automotive compliant).

GS7B016810FDT Applications

Ideal for precision analog circuits, sensor interfaces, and voltage divider networks, this resistor network excels in:

• Medical Devices: Stable performance in diagnostic equipment.
• Industrial Controls: Reliable operation in PLCs and motor drives.
• Test & Measurement: Low drift ensures accuracy in calibration systems.
• Communications: Signal integrity in RF and baseband circuits.

Conclusion of GS7B016810FDT

The GS7B016810FDT combines thin-film precision, ceramic durability, and compact SOIC packaging to address critical needs in high-reliability electronics. Its bussed architecture and low TCR make it a superior choice over generic arrays, particularly in environments requiring thermal stability and tight tolerance matching. While not automotive-qualified, its performance suits industrial, medical, and instrumentation applications where accuracy and longevity are paramount.