TT Electronics/IRC

GS7B016810JCT

GS7B016810JCT Description

The GS7B016810JCT from TT Electronics/IRC is a high-reliability ceramic thin-film resistor network designed for precision applications. Housed in a 14-pin narrow SOIC package, it features 13 bussed resistors with a common 681Ω resistance value and a ±5% absolute tolerance. The device operates within a wide temperature range of -55°C to +125°C, with derated power handling up to 125°C. Its ±100ppm/°C temperature coefficient ensures stable performance under thermal stress, while the 0.7W total power rating (0.05W per resistor) makes it suitable for compact, power-sensitive designs. The gull-wing termination and surface-mount (SOIC) package facilitate automated PCB assembly.

GS7B016810JCT Features

• Bussed Network Topology: Simplifies circuit design by connecting multiple resistors to a common node (BUS).
• High Power Density: 0.7W total dissipation in a compact 8.66mm × 5.99mm × 1.45mm footprint.
• Stable Thin-Film Technology: Delivers ±100ppm/°C TCR and ±0.25% ratio tolerance for precision applications.
• Robust Construction: Ceramic substrate enhances thermal and mechanical durability.
• Automation-Friendly: 1.27mm terminal pitch and gull-wing leads ensure compatibility with pick-and-place systems.
• Wide Voltage Rating: Supports up to 100V, ideal for industrial and instrumentation circuits.

GS7B016810JCT Applications

• Signal Conditioning: Precision voltage dividers in sensor interfaces (e.g., thermocouples, strain gauges).
• Industrial Controls: Bus termination and pull-up/pull-down networks in PLCs and motor drives.
• Test & Measurement Equipment: Stable reference resistors for calibration circuits.
• Automotive Electronics: Non-automotive grade but suitable for benign-environment subsystems like infotainment.
• Power Management: Current-limiting networks in low-power DC/DC converters.

Conclusion of GS7B016810JCT

The GS7B016810JCT excels in space-constrained, precision circuits requiring stable resistance ratios and moderate power handling. Its ceramic thin-film construction and bussed architecture offer superior reliability over thick-film alternatives, while the SOIC package ensures broad compatibility. Though not RoHS-compliant, it remains a cost-effective choice for industrial and instrumentation designs demanding tight tolerance and thermal stability. Ideal for engineers prioritizing performance-per-size in harsh operating environments.