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GS7B016811JDT
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GS7B016811JDT Description
GS7B016811JDT Description
The GS7B016811JDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 14-pin narrow SOIC package features 13 bussed resistors with a 6.81KΩ resistance value and a ±5% absolute tolerance, ensuring reliable performance in tightly controlled environments. The thin-film technology provides excellent stability with a ±100ppm/°C temperature coefficient, making it suitable for applications requiring minimal resistance drift over temperature variations. With a power rating of 0.7W (0.05W per resistor) and a maximum operating temperature of 125°C, this component is engineered for durability in surface-mount configurations.
GS7B016811JDT Features
- High-Density Integration: 13 resistors in a compact SOIC package (8.66mm x 5.99mm x 1.45mm) optimize board space.
- Precision Performance: ±5% tolerance and ±0.5% ratio tolerance ensure consistent signal integrity.
- Robust Construction: Ceramic case enhances thermal and mechanical stability.
- Wide Voltage Range: Supports up to 100V, suitable for industrial and automotive (non-AECQ) applications.
- Surface-Mount Ready: Gull-wing termination and 1.27mm pitch simplify automated assembly.
- Extended Temperature Range: Operates from 70°C to 125°C with derated power handling.
GS7B016811JDT Applications
This resistor network excels in:
- Analog Signal Conditioning: Precision voltage dividers and sensor interfaces in test equipment.
- Industrial Control Systems: PLCs and motor drives where space efficiency and thermal resilience are critical.
- Telecommunications: Impedance matching and filtering in RF modules.
- Medical Electronics: Low-drift circuits in diagnostic devices.
- Consumer Electronics: Dense PCB designs requiring reliable passive networks.
Conclusion of GS7B016811JDT
The GS7B016811JDT stands out for its ceramic-based reliability, tight tolerances, and compact SOIC footprint, making it a superior choice for engineers prioritizing precision and space savings. While not automotive-grade, its thin-film technology and wide operational range cater to industrial, medical, and telecom applications where stability under thermal stress is paramount. Its bussed architecture simplifies circuit design, reducing component count without compromising performance.



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