TT Electronics/IRC

GS7B0168R0JDT

GS7B0168R0JDT Description

The GS7B0168R0JDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. This 14-pin narrow SOIC package features 13 bussed resistors, each with a 68Ω resistance and an absolute tolerance of ±5%. The device operates within a wide temperature range of -55°C to +125°C, with a derated power range of 70°C to 125°C, ensuring reliability under thermal stress. Its thin-film technology delivers stable performance with a low temperature coefficient of ±100ppm/°C, minimizing resistance drift. The SOIC-C series construction offers a compact footprint (8.66mm x 5.99mm x 1.45mm) with gull-wing terminations for easy surface-mount assembly. Rated for 100V maximum voltage and 0.7W total power dissipation, it is ideal for space-constrained, high-density PCB designs.

GS7B0168R0JDT Features

• 13 bussed resistors in a 14-pin SOIC package, optimized for bus termination and pull-up/down applications.
• Ceramic substrate ensures excellent thermal stability and mechanical robustness.
• Thin-film technology provides precise resistance values (±5%) and low TCR (±100ppm/°C).
• 0.05W (1/20W) power rating per resistor, with a total power rating of 0.7W.
• Surface-mountable gull-wing leads with 1.27mm pitch for reliable soldering.
• Wide operating temperature range (-55°C to +125°C), suitable for industrial and automotive environments (though not PPAP/automotive-qualified).
• Non-RoHS compliant, making it suitable for legacy or specialized applications where lead-free restrictions do not apply.

GS7B0168R0JDT Applications

This resistor network excels in:

• Bus termination for high-speed digital circuits (e.g., DDR memory, FPGA interfaces).
• Voltage divider networks in precision analog systems.
• Pull-up/pull-down resistor arrays in microcontroller and logic circuits.
• Industrial control systems requiring stable resistance under thermal cycling.
• Legacy electronics where non-RoHS compliance is acceptable.

Conclusion of GS7B0168R0JDT

The GS7B0168R0JDT combines high-density integration, thermal resilience, and electrical precision, making it a versatile choice for engineers designing compact, high-reliability circuits. Its bussed architecture simplifies PCB layout, while the ceramic thin-film construction ensures long-term stability. Though not automotive-grade, its performance suits industrial, telecom, and computing applications where space efficiency and consistent resistance are critical. For designs requiring 68Ω bussed networks with tight ratio tolerance (±0.5%), this model offers a balanced blend of cost and performance.