TT Electronics/IRC

GS7B017152DCT

GS7B017152DCT Description

The GS7B017152DCT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 14-pin narrow SOIC package, this bussed (BUS) network integrates 13 thin-film resistors, each with a 71.5KΩ resistance and an absolute tolerance of ±0.5%. The device operates over a wide temperature range (70°C to 125°C) with a ±100ppm/°C temperature coefficient, ensuring stability in varying environmental conditions. Its 0.05W (1/20) power rating per resistor and 100V maximum voltage rating make it suitable for low-power, high-voltage circuits. The SOIC-C series construction features a rectangular ceramic case, gull-wing termination, and surface-mount compatibility, offering robust mechanical and electrical performance.

GS7B017152DCT Features

• Precision Performance: ±0.5% absolute tolerance and ±0.25% ratio tolerance for accurate signal conditioning.
• Robust Construction: Ceramic substrate and thin-film technology ensure durability and long-term reliability.
• Thermal Stability: Operates up to 125°C with minimal resistance drift (±100ppm/°C).
• Compact Design: 8.66mm (L) × 5.99mm (D) × 1.45mm (H) footprint, ideal for space-constrained PCBs.
• Bussed Configuration: Simplifies circuit design by connecting multiple resistors to a common node.
• Surface-Mount Ready: 1.27mm terminal pitch and gull-wing leads enable efficient automated assembly.

GS7B017152DCT Applications

This resistor network excels in precision analog and digital circuits, including:

• Voltage dividers and reference circuits in test/measurement equipment.
• Signal conditioning for sensors and transducers in industrial automation.
• Feedback networks in op-amp and ADC/DAC interfaces.
• Power supply balancing in low-power embedded systems.
• Automotive and aerospace electronics (non-automotive grade; verify compliance for critical use).

Conclusion of GS7B017152DCT

The GS7B017152DCT combines high precision, thermal resilience, and compact packaging, making it a versatile choice for engineers designing stable, high-performance circuits. Its ceramic thin-film construction and bussed architecture reduce component count and improve reliability in applications requiring tight tolerance and minimal drift. While not PPAP or automotive-qualified, it is well-suited for industrial, medical, and instrumentation systems where accuracy and space efficiency are paramount.