TT Electronics/IRC

GS7B017502JFT

GS7B017502JFT Description

The GS7B017502JFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. This 14-pin Narrow SOIC package features 13 bussed resistors with a 75 kΩ resistance value and a ±5% absolute tolerance, ensuring reliable signal integrity in compact circuit designs. Built with thin-film technology, it offers a ±100 ppm/°C temperature coefficient, maintaining stability across a wide operating range of -70°C to +125°C. The SOIC-C series construction provides robust mechanical durability, while the gull-wing termination enables secure surface-mount (SMT) assembly. With a 0.7W total power rating (0.05W per resistor) and 100V maximum voltage rating, this network is ideal for high-density PCB layouts requiring consistent performance under thermal stress.

GS7B017502JFT Features

• Bussed Network Design: 13 resistors interconnected for simplified bus line applications.
• High-Temperature Stability: Operates reliably up to 125°C with derated power at elevated temperatures.
• Precision Thin Film: Delivers low TCR (±100 ppm/°C) and tight ratio tolerance (±1%) for matched resistance pairs.
• Robust Ceramic Package: SOIC-14 case ensures mechanical strength and thermal dissipation.
• Surface-Mount Ready: Gull-wing leads with 1.27mm pitch for automated PCB assembly.
• Non-Automotive Grade: Suitable for industrial, telecom, and instrumentation use (PPAP not required).

GS7B017502JFT Applications

• Voltage Division Networks: Precision dividers in sensor interfaces or ADC circuits.
• Bus Termination: Signal integrity solutions for I²C, SPI, or CAN bus systems.
• Industrial Controls: Durable resistor arrays for PLCs, motor drives, and power supplies.
• Test & Measurement Equipment: Stable reference networks in calibration devices.
• Telecom Infrastructure: High-density PCBs in routers/switches requiring thermal resilience.

Conclusion of GS7B017502JFT

The GS7B017502JFT excels in applications demanding compactness, thermal stability, and matched resistance performance. Its ceramic SOIC package and thin-film technology provide superior reliability over epoxy-based networks, while the bussed architecture reduces component count in bus-oriented designs. Though not RoHS-compliant, it remains a cost-effective choice for non-consumer electronics where precision and durability are critical. Engineers will value its balance of power handling, tolerance accuracy, and ease of integration in space-constrained layouts.