TT Electronics/IRC

GS7B017680FDT

GS7B017680FDT Description

The GS7B017680FDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 14-pin Narrow SOIC package features 13 bussed resistors with a 768Ω resistance value and a tight ±1% absolute tolerance, ensuring reliable signal integrity and minimal deviation. Built with thin-film technology, it delivers excellent stability with a ±100ppm/°C temperature coefficient, making it suitable for environments with fluctuating thermal conditions. The SOIC-C series construction offers a compact footprint (8.66mm × 5.99mm × 1.45mm) with gull-wing terminations for easy surface-mount assembly. Rated for 100V maximum voltage and 0.7W total power dissipation, it operates reliably across a 70°C to 125°C derated power range, with a 125°C maximum operating temperature.

GS7B017680FDT Features

• 13 bussed resistors in a 14-pin SOIC package, ideal for bus termination and pull-up/down applications.
• Ceramic substrate ensures superior thermal performance and mechanical durability.
• Thin-film technology provides low noise, high precision, and excellent long-term stability.
• ±1% absolute tolerance and ±0.5% ratio tolerance for critical analog/digital circuits.
• Wide temperature range (-55°C to +125°C) with derated power up to 125°C.
• Gull-wing termination simplifies PCB assembly and inspection.
• Non-automotive grade (PPAP: No), suitable for industrial, telecom, and instrumentation use.

GS7B017680FDT Applications

This resistor network excels in:

• Bus termination for high-speed digital interfaces (e.g., DDR memory, FPGA I/O).
• Voltage divider networks in precision analog circuits.
• Pull-up/down resistor arrays for microcontrollers and logic devices.
• Signal conditioning in test/measurement equipment and data acquisition systems.
• Industrial control systems requiring stable, low-drift resistance under thermal stress.

Conclusion of GS7B017680FDT

The GS7B017680FDT combines high-density integration, exceptional thermal performance, and precision tolerances, making it a standout choice for engineers designing robust, space-constrained circuits. Its ceramic construction and thin-film resistors ensure reliability in harsh environments, while the SOIC package simplifies manufacturing. Though not RoHS-compliant, it remains a top-tier solution for industrial and telecom applications demanding low TCR and tight tolerance stability.