TT Electronics/IRC

GS7B017681JCT

GS7B017681JCT Description

The GS7B017681JCT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications requiring stable resistance values in compact form factors. This 14-pin narrow SOIC (SOIC-C Series) device integrates 13 bussed resistors with a 7.68KΩ resistance value, offering a ±5% absolute tolerance and an exceptional ±0.25% ratio tolerance. Built with thin-film technology, it delivers superior thermal stability with a ±100ppm/°C temperature coefficient, ensuring reliable performance across a -70°C to +125°C operating range. The 0.05W (1/20) power rating per resistor and 100V maximum voltage rating make it suitable for low-power, high-voltage circuits. Its ceramic case and gull-wing termination enable robust surface-mount assembly in space-constrained designs.

GS7B017681JCT Features

• Bussed Network Design: Simplifies PCB layout with shared connections (BUS circuit designator).
• High Precision: Tight ±0.25% ratio tolerance for matched resistance in differential circuits.
• Wide Temperature Range: Operates reliably from -70°C to +125°C with derated power.
• Robust Construction: Ceramic substrate enhances thermal and mechanical durability.
• Compact SOIC Package: 8.66mm × 5.99mm × 1.45mm dimensions with ±0.1mm length/height tolerances.
• Low TCR: ±100ppm/°C ensures minimal resistance drift.
• Surface-Mount Ready: Gull-wing leads with 1.27mm pitch for automated assembly.

GS7B017681JCT Applications

• Voltage Divider Networks: Precision ratio tolerance suits ADC/DAC reference circuits.
• Industrial Controls: Stable performance in harsh environments (e.g., motor drives, PLCs).
• Medical Electronics: Low-noise, high-reliability operation for diagnostic equipment.
• Automotive Systems (Non-Automotive Qualified): Auxiliary circuits where ceramic durability is critical.
• Power Management: Bussed design ideal for load-sharing in DC/DC converters.

Conclusion of GS7B017681JCT

The GS7B017681JCT excels in applications demanding precision, thermal resilience, and space efficiency. Its ceramic thin-film construction, combined with tight tolerances and bussed topology, offers a competitive edge over polymer-based networks. While not PPAP or automotive-qualified, it is a cost-effective solution for industrial, medical, and instrumentation designs requiring long-term stability. Engineers will appreciate its balance of performance and manufacturability in high-density PCBs.