TT Electronics/IRC

GS7B0178R7JDT

GS7B0178R7JDT Description

The GS7B0178R7JDT from TT Electronics/IRC is a high-reliability ceramic resistor network designed for precision applications in demanding environments. Housed in a 14-pin narrow SOIC package, this bussed network integrates 13 thin-film resistors with a 78.7Ω resistance value and a ±5% absolute tolerance. Its ±100ppm/°C temperature coefficient ensures stable performance across a wide operating range of -70°C to +125°C, making it suitable for industrial and automotive-grade designs. The SOIC-C series construction features a rectangular ceramic substrate with gull-wing terminations, offering robust mechanical and thermal stability. With a 0.7W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances compactness (8.66mm × 5.99mm × 1.45mm) with durability.

GS7B0178R7JDT Features

• High-Density Integration: 13 resistors in a 14-pin SOIC, saving PCB space.
• Superior Thermal Performance: Ceramic case and thin-film technology minimize drift under thermal stress.
• Precision Tolerance: ±5% absolute tolerance and ±0.5% ratio tolerance for matched resistance values.
• Wide Temperature Range: Operates from -70°C to +125°C with derated power up to 125°C.
• Robust Construction: Gull-wing leads and surface-mount design enhance solder joint reliability.
• Non-Automotive PPAP: Ideal for industrial and commercial applications where PPAP compliance is not required.

GS7B0178R7JDT Applications

• Voltage Divider Networks: Precision signal conditioning in sensor interfaces and ADC/DAC circuits.
• Bus Termination: Effective impedance matching for high-speed data lines in communication systems.
• Industrial Controls: Stable performance in PLC modules, power supplies, and motor drives.
• Test & Measurement Equipment: Reliable resistance matching for calibration circuits and load simulation.
• Aerospace & Defense: Ceramic construction suits harsh-environment applications with thermal cycling demands.

Conclusion of GS7B0178R7JDT

The GS7B0178R7JDT excels in space-constrained, high-reliability designs requiring tight tolerance and thermal stability. Its ceramic SOIC package and bussed architecture provide a cost-effective alternative to discrete resistors, reducing assembly complexity. While not PPAP-compliant, it is a robust choice for industrial, telecom, and instrumentation applications where precision and durability are critical. Engineers will appreciate its balance of performance, compactness, and ease of integration in demanding circuits.