TT Electronics/IRC

GS7B018062JFT

GS7B018062JFT Description

The GS7B018062JFT from TT Electronics/IRC is a high-reliability ceramic resistor network designed for precision applications in demanding environments. Housed in a 14-pin narrow SOIC package, this bussed (BUS) configuration integrates 13 thin-film resistors, each with a 80.6KΩ resistance and a ±5% absolute tolerance. The device operates over a wide temperature range of -70°C to +125°C, with a derated power range up to 125°C, ensuring stability in harsh conditions. Its ±100ppm/°C temperature coefficient and ±1% ratio tolerance make it ideal for circuits requiring tight resistance matching. The SOIC-C series construction features a rectangular ceramic case, gull-wing termination, and a 0.05W (1/20) power rating per resistor, totaling 0.7W for the network.

GS7B018062JFT Features

• Robust Construction: Ceramic substrate ensures high thermal stability and mechanical durability.
• Precision Performance: Thin-film technology delivers low TCR (±100ppm/°C) and tight tolerance (±5% absolute, ±1% ratio).
• High Voltage Handling: Supports up to 100V maximum voltage rating, suitable for industrial and automotive (non-AEC-Q200) applications.
• Compact & Reliable: 8.66mm x 5.99mm footprint with 1.45mm profile, optimized for space-constrained PCBs.
• Surface-Mount Design: Gull-wing terminals with 1.27mm pitch facilitate automated assembly.
• Non-Automotive Grade: Compliant with EAR99 ECCN but not PPAP-capable or RoHS-compliant.

GS7B018062JFT Applications

• Industrial Control Systems: Precision voltage dividers, feedback networks in power supplies.
• Test & Measurement Equipment: Calibration circuits, sensor signal conditioning.
• Telecommunications: Impedance matching in RF modules and base stations.
• Medical Devices: Analog signal processing where stability and accuracy are critical.
• Legacy Electronics: Repair or replacement in non-RoHS-compliant systems.

Conclusion of GS7B018062JFT

The GS7B018062JFT excels in environments requiring high precision, thermal resilience, and compact integration. Its ceramic thin-film design and bussed architecture offer superior performance over standard thick-film networks, particularly in high-temperature or high-voltage scenarios. While not suited for automotive or RoHS-mandated designs, it remains a top choice for industrial, medical, and telecom applications demanding reliability and tight tolerance matching. Engineers will appreciate its balance of performance, durability, and ease of integration in surface-mount assemblies.