TT Electronics/IRC

GS7B0180R6JT

GS7B0180R6JT Description

The GS7B0180R6JT from TT Electronics/IRC is a high-reliability ceramic resistor network designed for precision applications in demanding environments. This 14-pin narrow SOIC package features 13 bussed resistors with a 80.6Ω resistance value and a ±5% tolerance, ensuring stable performance across a wide temperature range of 70°C to 125°C. Built with thin-film technology, it offers a low temperature coefficient of ±100ppm/°C, minimizing resistance drift under thermal stress. The SOIC-C series construction provides robust mechanical stability, with a compact footprint (8.66mm × 5.99mm × 1.45mm) and gull-wing terminations for secure surface-mount assembly. Rated for 100V maximum voltage and 0.7W total power dissipation, it is ideal for space-constrained, high-density PCB designs.

GS7B0180R6JT Features

• 13 bussed resistors in a 14-pin SOIC package, optimized for bus termination and signal conditioning.
• Ceramic substrate ensures superior thermal stability and durability in harsh conditions.
• Thin-film technology delivers precise ±5% tolerance and low ±100ppm/°C TCR.
• 0.05W (1/20W) power rating per resistor with 0.7W total power handling.
• Surface-mount design with 1.27mm terminal pitch for easy integration into automated assembly processes.
• Wide operating temperature range (-55°C to +125°C) with derated performance up to 125°C.
• Non-automotive and non-PPAP compliant, suited for industrial and commercial applications.

GS7B0180R6JT Applications

This resistor network excels in:

• Voltage division and bus termination in digital communication systems (e.g., CAN, I2C).
• Impedance matching for high-speed PCB designs, reducing signal reflection.
• Sensor interface circuits requiring stable resistance under thermal fluctuations.
• Power supply decoupling and filter networks in embedded systems.
• Industrial control modules where compact size and reliability are critical.

Conclusion of GS7B0180R6JT

The GS7B0180R6JT stands out for its ceramic-based construction, low TCR, and high power density, making it a superior choice for precision electronics. Its bussed architecture simplifies circuit design, while the SOIC package ensures compatibility with modern SMT processes. Though not RoHS compliant, it remains a robust solution for industrial and telecom applications demanding long-term stability. Engineers will appreciate its balance of performance, size, and cost-effectiveness in high-reliability systems.