TT Electronics/IRC

GS7B018252JCT

GS7B018252JCT Description

The GS7B018252JCT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. Housed in a 14-pin narrow SOIC package, this bussed (BUS) network integrates 13 thin-film resistors, each with a resistance value of 82.5KΩ and a ±5% absolute tolerance. The device operates over a wide temperature range of -70°C to +125°C, with a derated power capability up to 125°C. Its ±100ppm/°C temperature coefficient ensures stable performance under thermal stress, while the 0.7W total power rating (0.05W per resistor) supports robust circuit operation. The SOIC-C series construction features gull-wing terminations for reliable surface-mount (SMD) assembly, with tight dimensional tolerances (±0.1mm height/length, ±0.2mm depth).

GS7B018252JCT Features

• High-Density Integration: 13 resistors in a compact 8.66mm × 5.99mm × 1.45mm SOIC package.
• Superior Thermal Performance: Ceramic substrate enhances heat dissipation, ideal for high-temperature environments.
• Precision Thin-Film Technology: Delivers ±0.25% ratio tolerance for matched resistor pairs, critical for differential circuits.
• Wide Voltage Rating: Supports up to 100V, suitable for industrial and automotive (non-AECQ) applications.
• Stable TCR: ±100ppm/°C ensures minimal resistance drift across operating conditions.
• Non-RoHS Compliant: Preferred for legacy or specialized systems requiring leaded components.

GS7B018252JCT Applications

• Analog Signal Conditioning: Precision voltage dividers in sensor interfaces (e.g., thermocouples, strain gauges).
• Industrial Control Systems: Bus termination networks for PLCs and motor drives.
• Test & Measurement Equipment: Reference resistor arrays in calibration circuits.
• Power Management: Current-limiting networks in low-power DC/DC converters.
• Aerospace & Defense: Ruggedized electronics where ceramic durability is critical.

Conclusion of GS7B018252JCT

The GS7B018252JCT excels in space-constrained, high-reliability designs requiring tight tolerance and thermal stability. Its bussed architecture simplifies PCB layout, while the ceramic SOIC package offers mechanical robustness unmatched by polymer-based networks. Though not PPAP or automotive-qualified, it is a cost-effective solution for industrial, instrumentation, and harsh-environment applications where precision and durability are paramount. Engineers should verify compatibility for RoHS-restricted designs.