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GS7B0190R9GGT
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GS7B0190R9GGT Description
GS7B0190R9GGT Description
The GS7B0190R9GGT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 14-pin narrow SOIC package features 13 bussed resistors with a 90.9Ω resistance value, offering a ±2% absolute tolerance and ±2% ratio tolerance. Built with thin-film technology, it ensures stable performance across a wide temperature range (70°C to 125°C) and delivers a power rating of 0.7W (0.05W per resistor). The device is housed in a rectangular SOIC case with gull-wing termination, making it ideal for surface-mount applications. Its ±100ppm/°C temperature coefficient and 100V maximum voltage rating make it suitable for high-reliability environments.
GS7B0190R9GGT Features
- 13 bussed resistors in a 14-pin SOIC package for compact, high-density designs.
- Ceramic substrate ensures excellent thermal stability and durability.
- Thin-film technology provides low noise and high precision (±2% tolerance).
- Wide operating temperature range (70°C to 125°C) with derated power handling.
- Gull-wing termination for reliable surface-mount assembly.
- Low TCR (±100ppm/°C) for minimal resistance drift under thermal stress.
- Non-compliant with EU RoHS, suitable for legacy or specialized applications.
- 1.27mm terminal pitch for compatibility with standard PCB layouts.
GS7B0190R9GGT Applications
This resistor network is ideal for:
- Voltage divider circuits in precision analog systems.
- Signal conditioning in industrial sensors and measurement equipment.
- Bus termination in communication and networking hardware.
- Automotive electronics (non-automotive grade but suitable for benign environments).
- Medical devices requiring stable, low-drift resistance networks.
- Power management modules where space-efficient, multi-resistor solutions are needed.
Conclusion of GS7B0190R9GGT
The GS7B0190R9GGT stands out for its robust ceramic construction, high precision, and thermal stability, making it a reliable choice for engineers designing compact, high-performance circuits. While not PPAP or automotive-qualified, its thin-film accuracy and bussed architecture make it well-suited for industrial, medical, and communication applications. Its SOIC footprint ensures easy integration into modern PCB designs, offering a balance of performance, durability, and space savings.



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