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GS7B019100JBT
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GS7B019100JBT Description
GS7B019100JBT Description
The GS7B019100JBT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 14-pin narrow SOIC package features 13 bussed resistors with a 910Ω resistance value and a ±5% absolute tolerance, ensuring reliable performance in tightly controlled environments. Built with thin-film technology, it offers excellent stability with a ±100ppm/°C temperature coefficient, making it suitable for temperature-sensitive designs. The SOIC-C series construction provides robust mechanical integrity, while the gull-wing termination ensures secure surface mounting. With a maximum operating temperature of 125°C and a derated power range of 70–125°C, this network is engineered for durability under thermal stress.
GS7B019100JBT Features
- 13 bussed resistors in a 14-pin SOIC package for compact, high-density PCB layouts.
- Thin-film technology ensures low noise, high precision, and stable performance.
- ±5% absolute tolerance and ±0.1% ratio tolerance for consistent signal integrity.
- Wide temperature range (70–125°C derated, 125°C max) for harsh environments.
- 0.05W (1/20) power rating per resistor, totaling 0.7W for the network.
- 100V maximum voltage rating and 5.99mm × 8.66mm × 1.45mm compact footprint.
- Gull-wing termination for reliable surface-mount (SMD) assembly.
- Ceramic case enhances thermal and mechanical resilience.
GS7B019100JBT Applications
This resistor network is ideal for:
- Analog and digital signal conditioning in industrial control systems.
- Voltage division and pull-up/down networks in microcontroller circuits.
- Precision instrumentation requiring stable resistance ratios (e.g., sensors, ADCs).
- Automotive electronics (non-automotive PPAP version) where temperature fluctuations are critical.
- Power management modules benefiting from its high-voltage tolerance (100V).
Conclusion of GS7B019100JBT
The GS7B019100JBT stands out for its ceramic thin-film construction, tight tolerance, and thermal resilience, making it a superior choice for precision applications. Its bussed design simplifies circuit routing, while the SOIC package ensures compatibility with automated assembly processes. While not RoHS-compliant, its performance in high-temperature and high-voltage scenarios makes it a reliable solution for industrial, automotive (non-PPAP), and instrumentation designs requiring long-term stability.



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