TT Electronics/IRC

GS7B021071GFT

GS7B021071GFT Description

The GS7B021071GFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in a 14-pin narrow SOIC package, this bussed network integrates 13 thin-film resistors, each with a 1.07KΩ resistance and a tight ±2% absolute tolerance. Its ±50ppm/°C temperature coefficient ensures stability across a wide operating range of 70°C to 125°C, making it suitable for demanding environments. The device features a 0.7W total power rating (0.05W per resistor) and a 100V maximum voltage rating, with gull-wing terminations for reliable surface-mount assembly. The SOIC-C series construction offers robust mechanical integrity, with dimensions of 8.66mm (L) x 5.99mm (D) x 1.45mm (H) and tight tolerances (±0.1mm height/length, ±0.2mm depth).

GS7B021071GFT Features

• Ceramic substrate for enhanced thermal performance and durability.
• Thin-film technology delivers precision and low noise.
• Bussed network simplifies circuit design by interconnecting resistors.
• ±2% absolute tolerance and ±1% ratio tolerance for high accuracy.
• Wide temperature range (70°C to 125°C derated) with ±50ppm/°C stability.
• 14-pin SOIC package with 1.27mm pitch for compact PCB layouts.
• Non-automotive and non-PPAP compliant, ideal for industrial/consumer electronics.
• Non-RoHS (legacy applications requiring leaded components).

GS7B021071GFT Applications

This resistor network excels in:

• Voltage division and current limiting in precision analog circuits.
• Signal conditioning for sensors, ADCs, and DACs.
• Industrial control systems requiring stable, high-density resistor arrays.
• Legacy electronics where leaded components are mandated.
• Power management modules due to its 0.7W total dissipation capability.

Conclusion of GS7B021071GFT

The GS7B021071GFT combines precision, reliability, and compact design, making it a standout choice for engineers needing stable resistor networks in harsh environments. Its ceramic construction, tight tolerances, and bussed architecture reduce component count and simplify layouts, while the SOIC package ensures compatibility with automated assembly. Though not RoHS-compliant, it remains invaluable for legacy systems and industrial applications demanding proven performance.