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GS7B021182CCT
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GS7B021182CCT Description
GS7B021182CCT Description
The GS7B021182CCT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 14-pin narrow SOIC package, this bussed (BUS) network integrates 13 thin-film resistors, each with a 11.8KΩ resistance and an exceptional ±0.25% absolute tolerance. The device operates over a wide temperature range of 70°C to 125°C (derated) with a ±50ppm/°C temperature coefficient, ensuring stability in fluctuating environments. Its 0.05W (1/20) power rating per resistor and 100V maximum voltage rating make it suitable for precision analog and digital circuits. The SOIC-C series construction features a rectangular ceramic case with gull-wing terminations, optimized for surface-mount assembly.
GS7B021182CCT Features
- High Precision: ±0.25% tolerance and ±0.25% ratio tolerance for matched resistance performance.
- Robust Construction: Ceramic substrate ensures durability and thermal stability.
- Space-Efficient: Compact 8.66mm × 5.99mm × 1.45mm footprint with 1.27mm terminal pitch.
- Wide Operating Range: Supports -55°C to 125°C (full power) and 70°C to 125°C (derated).
- Low TCR: ±50ppm/°C minimizes resistance drift.
- Automotive-Grade Alternatives: While not PPAP or automotive-qualified, its reliability suits industrial and telecom applications.
GS7B021182CCT Applications
- Precision Voltage Dividers: Ideal for ADC/DAC reference circuits due to tight tolerance matching.
- Signal Conditioning: Used in sensor interfaces and instrumentation amplifiers.
- Power Management: Bussed design simplifies bus termination in low-power digital systems.
- Industrial Controls: Stable performance in PLCs and motor drives.
- Telecom Hardware: Suitable for RF modules and baseband processing where consistency is critical.
Conclusion of GS7B021182CCT
The GS7B021182CCT excels in precision and reliability, offering superior resistance matching and thermal performance for high-end electronics. Its ceramic thin-film technology and SOIC packaging provide a balance of durability and miniaturization, making it a preferred choice for industrial, telecom, and test equipment. While not RoHS-compliant, its technical merits justify use in non-consumer applications requiring long-term stability. Engineers should evaluate its derated power specs for high-temperature environments.



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