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GS7B021401BAT
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GS7B021401BAT Description
GS7B021401BAT Description
The GS7B021401BAT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 14-pin narrow SOIC package, this bussed (BUS) network integrates 13 thin-film resistors, each with a 1.4KΩ resistance and an exceptional ±0.1% absolute tolerance (±0.05% ratio tolerance). Its ±50ppm/°C temperature coefficient ensures stability across a wide operating range of -70°C to +125°C, making it suitable for environments with thermal fluctuations. The SOIC-C series construction features a rectangular ceramic case with gull-wing terminations, optimized for surface-mount (SMD) assembly. With a 0.7W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances precision and robustness.
GS7B021401BAT Features
- High Precision: ±0.1% tolerance and ±50ppm/°C TCR for critical signal conditioning.
- Robust Construction: Ceramic substrate ensures thermal stability and durability.
- Space-Efficient: Compact 8.66mm × 5.99mm × 1.45mm footprint (SOIC package) with 1.27mm terminal pitch.
- Bussed Design: Simplified PCB layout with common-node configuration (BUS circuit designator).
- Wide Temperature Range: Operates from -70°C to +125°C with derated power at elevated temperatures.
- Thin-Film Technology: Delivers low noise and high reliability for precision circuits.
GS7B021401BAT Applications
Ideal for industrial, medical, and instrumentation systems requiring stable resistance networks, such as:
- Voltage dividers and current sensing in PLCs.
- ADC/DAC reference networks in test equipment.
- Feedback loops in power supplies and motor controls.
- Signal conditioning in automotive ECUs (despite non-automotive PPAP status).
Its non-RoHS compliance may restrict use in EU-regulated consumer electronics but suits niche industrial applications.
Conclusion of GS7B021401BAT
The GS7B021401BAT excels in precision and thermal performance, offering engineers a reliable solution for high-accuracy analog circuits. Its ceramic SOIC package and bussed architecture reduce design complexity, while thin-film technology ensures long-term stability. Though unsuitable for automotive PPAP or RoHS-regulated projects, it remains a top choice for industrial and instrumentation designs where tolerance and temperature resilience are critical.



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