TT Electronics/IRC

GS7B021401DBT

GS7B021401DBT Description

The GS7B021401DBT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding surface-mount applications. Packaged in a 14-pin narrow SOIC (SOIC-C series), this bussed network integrates 13 thin-film resistors, each with a 1.4KΩ resistance and an absolute tolerance of ±0.5%. Its ±50ppm/°C temperature coefficient ensures stability across a wide operating range of -70°C to +125°C, making it suitable for environments with thermal fluctuations. The 0.05W (1/20) power rating per resistor and 100V maximum voltage rating provide reliable performance in low-power circuits.

GS7B021401DBT Features

• Ceramic substrate for enhanced thermal and mechanical durability.
• Thin-film technology delivers high precision (±0.5%) and low TCR (±50ppm/°C).
• Bussed configuration simplifies circuit design by interconnecting resistors.
• Gull-wing termination ensures secure surface mounting (SOIC package).
• Compact dimensions: 8.66mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm).
• Non-automotive (PPAP No) but ideal for industrial and instrumentation use.
• 0.7W total power rating for distributed load handling.

GS7B021401DBT Applications

This resistor network excels in:

• Precision voltage dividers and signal conditioning circuits.
• Medical devices requiring stable, low-drift components.
• Test and measurement equipment (e.g., multimeters, oscilloscopes).
• Industrial control systems where space efficiency and reliability are critical.
• Communication infrastructure (e.g., RF modules, filter networks).

Conclusion of GS7B021401DBT

The GS7B021401DBT stands out for its ceramic construction, tight tolerances, and bussed design, offering superior performance in precision analog circuits. While not RoHS-compliant, its thermal stability and thin-film accuracy make it a preferred choice for engineers prioritizing long-term reliability in harsh environments. Its SOIC package ensures compatibility with standard SMT processes, streamlining integration into high-density PCB layouts.