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GS7B021401FDT
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GS7B021401FDT Description
GS7B021401FDT Description
The GS7B021401FDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in a 14-pin narrow SOIC package, it features 13 bussed resistors with a 1.4KΩ resistance value and a tight ±1% absolute tolerance. The device operates over a wide temperature range of -70°C to +125°C, with a derated power range of 70°C to 125°C, ensuring reliability in demanding environments. Its thin-film technology and ±50ppm/°C temperature coefficient provide exceptional stability and accuracy. With a power rating of 0.7W (0.05W per resistor) and a maximum voltage rating of 100V, this network is ideal for high-density PCB designs requiring consistent performance.
GS7B021401FDT Features
- Ceramic case for enhanced thermal and mechanical stability.
- SOIC package (8.66mm x 5.99mm x 1.45mm) with gull-wing termination for easy surface mounting.
- Bussed circuit design simplifies routing in bus-oriented applications.
- Low TCR (±50ppm/°C) ensures minimal resistance drift over temperature.
- 1% tolerance and ±0.5% ratio tolerance for precision signal conditioning.
- Wide operating temperature (-70°C to +125°C) suitable for industrial and automotive-grade applications (though not PPAP or Automotive certified).
- 100V maximum voltage rating supports higher-voltage circuits.
GS7B021401FDT Applications
This resistor network excels in:
- Voltage dividers and pull-up/pull-down networks in digital systems.
- Signal conditioning for ADCs, DACs, and sensor interfaces.
- Bus termination in communication and memory circuits.
- Industrial control systems requiring stable, high-density resistor arrays.
- Medical electronics where precision and reliability are critical.
Conclusion of GS7B021401FDT
The GS7B021401FDT stands out for its ceramic construction, precision tolerances, and robust thermal performance, making it a superior choice for engineers designing high-reliability systems. While not automotive-qualified, its wide temperature range and thin-film technology ensure consistent operation in industrial, medical, and communication applications. Its compact SOIC footprint and bussed design further simplify integration, offering a balance of performance and space efficiency.



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