TT Electronics/IRC

GS7B021471DT

GS7B021471DT Description

The GS7B021471DT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 14-pin narrow SOIC package, this bussed (BUS) configuration device integrates 13 thin-film resistors, each with a 1.47 kΩ resistance and an ultra-tight ±0.5% tolerance. Its ±50 ppm/°C temperature coefficient ensures stable performance across a wide operating range of -70°C to +125°C, making it suitable for environments with fluctuating thermal conditions. The SOIC-C series construction features a rectangular ceramic case with gull-wing terminations, optimized for surface-mount (SMD) assembly. With a 0.7W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances compactness with robustness.

GS7B021471DT Features

• Precision Engineering: Thin-film technology delivers ±0.5% absolute tolerance and low TCR (±50 ppm/°C).
• Durable Construction: Ceramic substrate enhances thermal stability and mechanical strength.
• Space-Efficient Design: 8.66mm × 5.99mm × 1.45mm footprint (SOIC package) suits high-density PCBs.
• Bussed Topology: Simplifies circuit design by connecting multiple resistors to a common node (BUS).
• Reliable Performance: 125°C maximum operating temperature and derated power up to 125°C.
• Strict Dimensional Tolerances: ±0.1mm (length/height) and ±0.2mm (depth) ensure consistent mounting.

GS7B021471DT Applications

Ideal for precision analog and digital circuits requiring stable resistance networks, such as:

• Voltage dividers in sensor interfaces and ADC/DAC circuits.
• Pull-up/pull-down networks in microcontrollers and FPGAs.
• Signal conditioning for industrial automation and test equipment.
• Automotive subsystems (non-AECQ qualified; suitable for non-safety-critical roles).
• Medical devices where low drift and high accuracy are critical.

Conclusion of GS7B021471DT

The GS7B021471DT excels in applications demanding high precision, thermal resilience, and compactness. Its ceramic thin-film design and bussed architecture offer superior performance over standard thick-film networks, particularly in environments with thermal stress or space constraints. While not PPAP or automotive-grade, its 0.5% tolerance and low TCR make it a cost-effective choice for industrial, medical, and instrumentation designs. Engineers will appreciate its repeatable performance and compatibility with automated SMD processes.