TT Electronics/IRC

GS7B021472BBT

GS7B021472BBT Description

The GS7B021472BBT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 14-pin narrow SOIC package, this bussed network integrates 13 thin-film resistors with a 14.7KΩ resistance value and an exceptional ±0.1% absolute tolerance. Its ±50ppm/°C temperature coefficient ensures stability across a wide operating range of -70°C to +125°C, making it suitable for environments with thermal fluctuations. The SOIC-C series construction features a rectangular ceramic case with gull-wing terminations, optimized for surface-mount assembly. With a 0.7W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances performance and reliability in compact designs.

GS7B021472BBT Features

• Precision Tolerance: ±0.1% absolute and ratio tolerance for critical signal conditioning.
• Robust Construction: Ceramic substrate with thin-film technology for low noise and high stability.
• Thermal Resilience: Operates from -70°C to +125°C with derated power up to 125°C.
• Space-Efficient: Compact 8.66mm × 5.99mm × 1.45mm footprint (SOIC-14) with 1.27mm terminal pitch.
• Automation-Friendly: Gull-wing leads enable reliable surface-mount (SMD) placement.
• Non-Automotive: Ideal for industrial and instrumentation use (PPAP not required).

GS7B021472BBT Applications

This resistor network excels in:

• Precision Analog Circuits: Voltage dividers, feedback networks, and DAC/ADC interfaces.
• Test & Measurement Equipment: High-accuracy signal scaling and calibration.
• Medical Electronics: Stable performance in diagnostic devices.
• Industrial Controls: Robust operation in PLCs and sensor interfaces.
• Aerospace & Defense: Reliable performance in extreme temperatures.

Conclusion of GS7B021472BBT

The GS7B021472BBT stands out for its tight tolerances, ceramic-based durability, and thermal stability, making it a superior choice for precision applications. While not RoHS-compliant, its thin-film technology and SOIC packaging cater to engineers prioritizing accuracy and space constraints. Ideal for high-reliability systems, it bridges the gap between performance and miniaturization in advanced electronics.