TT Electronics/IRC

GS7B021741FCT

GS7B021741FCT Description

The GS7B021741FCT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 14-pin Narrow SOIC device features 13 bussed resistors with a 1.74KΩ resistance value and an absolute tolerance of ±1%, ensuring consistent performance in precision circuits. Built with thin-film technology, it offers a low temperature coefficient (±50ppm/°C) and stable operation across a wide temperature range (70°C to 125°C). The SOIC package with gull-wing termination facilitates easy surface-mount assembly, while its compact dimensions (8.66mm x 5.99mm x 1.45mm) make it ideal for space-constrained designs.

GS7B021741FCT Features

• High Precision: 1% tolerance and ±0.25% ratio tolerance for accurate signal conditioning.
• Robust Construction: Ceramic case ensures durability and thermal stability.
• Wide Operating Range: 125°C maximum temperature with derated power up to 0.7W total (0.05W per resistor).
• Low TCR: ±50ppm/°C minimizes resistance drift under thermal stress.
• Surface-Mount Ready: Gull-wing terminals and 1.27mm pitch for reliable PCB integration.
• Bussed Configuration: Simplifies circuit design in voltage divider and bus termination applications.

GS7B021741FCT Applications

• Precision Analog Circuits: Ideal for DAC/ADC reference networks and sensor signal conditioning.
• Industrial Electronics: Suitable for PLC modules, power management systems, and test equipment.
• Automotive Systems: Despite being non-automotive graded, it fits non-safety-critical applications like infotainment or dashboard electronics.
• Communication Hardware: Used in termination networks for high-speed data lines.

Conclusion of GS7B021741FCT

The GS7B021741FCT excels in precision, thermal performance, and compactness, making it a reliable choice for industrial, communication, and instrumentation designs. Its thin-film technology and bussed architecture reduce component count while maintaining accuracy, offering a cost-effective solution for high-density PCBs. Engineers will appreciate its balance of stability, power handling, and ease of integration in critical circuits.