TT Electronics/IRC

GS7B021800FDT

GS7B021800FDT Description

The GS7B021800FDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 14-pin narrow SOIC (SOIC-C Series) device integrates 13 bussed resistors, each with a 180Ω resistance and a tight ±1% absolute tolerance, ensuring reliable signal integrity. Built with thin-film technology, it delivers excellent stability with a low ±50ppm/°C temperature coefficient, making it suitable for environments with fluctuating thermal conditions. The network operates within a -70°C to +125°C temperature range and supports a maximum voltage rating of 100V, with a 0.7W total power rating (0.05W per resistor). Its gull-wing termination and surface-mount design facilitate easy PCB integration, while the ceramic case enhances durability and heat dissipation.

GS7B021800FDT Features

• 13 bussed resistors in a 14-pin SOIC package, optimized for space-constrained designs.
• Ceramic substrate ensures superior thermal performance and mechanical robustness.
• Thin-film technology provides high precision (±1% tolerance) and low TCR (±50ppm/°C).
• Wide operating range: -70°C to +125°C, derated up to 125°C.
• Compact dimensions: 8.66mm (L) × 5.99mm (D) × 1.45mm (H), with tight tolerances (±0.1mm L/H, ±0.2mm D).
• Gull-wing leads (1.27mm pitch) for reliable surface-mount assembly.
• Non-automotive grade (PPAP: No), ideal for industrial and telecom applications.

GS7B021800FDT Applications

This resistor network excels in precision analog circuits, voltage division, and bus termination in:

• Industrial control systems requiring stable resistance under thermal stress.
• Telecommunications equipment (e.g., signal conditioning, impedance matching).
• Test and measurement instruments demanding low drift and high accuracy.
• Power management modules where consistent performance at elevated temperatures is critical.

Conclusion of GS7B021800FDT

The GS7B021800FDT stands out for its ceramic construction, thin-film precision, and bussed architecture, offering engineers a reliable solution for high-accuracy applications. Its wide temperature range, low TCR, and compact SOIC footprint make it a preferred choice over bulkier or less stable alternatives. While not RoHS-compliant, its robustness and performance justify its use in industrial and telecom systems where reliability is paramount.