TT Electronics/IRC

GS7B021802DT

GS7B021802DT Description

The GS7B021802DT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 14-pin narrow SOIC device features 13 bussed resistors with a 18KΩ resistance value and an exceptional ±0.5% absolute tolerance, ensuring reliable performance in precision circuits. Built with thin-film technology, it offers a ±50ppm/°C temperature coefficient, maintaining stability across a wide operating range of -70°C to +125°C. The SOIC package (8.66mm x 5.99mm x 1.45mm) with gull-wing terminations ensures compatibility with automated surface-mount assembly processes. Rated for 100V maximum voltage and 0.7W total power dissipation, it is ideal for space-constrained designs requiring high accuracy and thermal resilience.

GS7B021802DT Features

• Bussed Network Design: 13 resistors connected in a bus configuration, simplifying PCB layout.
• High Precision: ±0.5% tolerance and ±50ppm/°C TCR for stable performance in varying environments.
• Robust Construction: Ceramic case ensures durability and thermal conductivity.
• Surface-Mount Ready: Gull-wing terminals with 1.27mm pitch for easy SMD assembly.
• Wide Temperature Range: Operates from -70°C to +125°C with derated power up to 125°C.
• Compact Footprint: SOIC package (8.66mm x 5.99mm) saves board space.
• High Voltage Rating: Supports up to 100V, suitable for industrial and automotive-grade applications.

GS7B021802DT Applications

• Precision Analog Circuits: Voltage dividers, feedback networks, and sensor conditioning.
• Industrial Electronics: PLCs, motor controls, and power management systems.
• Automotive Systems (non-AECQ): Infotainment, lighting, and dashboard electronics.
• Test & Measurement Equipment: Calibration circuits and signal processing.
• Medical Devices: Low-noise, high-stability instrumentation.

Conclusion of GS7B021802DT

The GS7B021802DT stands out for its combination of precision, compactness, and thermal resilience, making it a superior choice for applications requiring tight tolerance and reliability. Its bussed architecture reduces component count, while the ceramic SOIC package ensures longevity in harsh environments. Though not PPAP or AECQ-qualified, it is ideal for industrial, medical, and high-end consumer electronics where accuracy and space efficiency are critical. Engineers will appreciate its balance of performance and manufacturability in advanced circuit designs.