TT Electronics/IRC

GS7B021802JBT

GS7B021802JBT Description

The GS7B021802JBT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. This 14-pin narrow SOIC package features 13 bussed resistors with a 18KΩ resistance value and an absolute tolerance of ±5%, ensuring reliable signal conditioning and voltage division. Built with thin-film technology, it offers a low temperature coefficient of ±50ppm/°C, maintaining stability across a wide operating range of -55°C to +125°C. The SOIC-C series construction provides robust mechanical integrity, with a compact footprint (8.66mm x 5.99mm x 1.45mm) and gull-wing termination for easy surface-mount assembly. Rated for 100V maximum voltage and 0.7W total power dissipation, it is ideal for high-density PCB designs requiring consistent performance under thermal stress.

GS7B021802JBT Features

• 13 bussed resistors in a 14-pin SOIC package, optimized for bus termination and pull-up/down applications.
• Ceramic substrate ensures superior thermal conductivity and durability.
• Thin-film technology delivers ±50ppm/°C TCR and ±5% tolerance, with ±0.1% ratio tolerance for matched networks.
• 0.05W (1/20W) power rating per resistor, totaling 0.7W for the array.
• Surface-mount design with 1.27mm terminal pitch for automated assembly compatibility.
• Wide temperature range (-55°C to +125°C) with derated power up to 125°C.
• Non-automotive, non-PPAP compliant, suited for industrial and commercial use.

GS7B021802JBT Applications

This resistor network excels in:

• Voltage division and signal conditioning in analog/digital hybrid circuits.
• Bus termination for high-speed data lines (e.g., DDR memory, CAN buses).
• Pull-up/down networks in microcontroller and FPGA systems.
• Precision instrumentation requiring stable resistance ratios (±0.1%).
• Industrial control systems where thermal stability and compact size are critical.

Conclusion of GS7B021802JBT

The GS7B021802JBT stands out for its ceramic construction, tight tolerance, and thermal resilience, making it a superior choice for high-reliability electronics. Its bussed architecture simplifies PCB layout, while the thin-film technology ensures long-term accuracy. Though not RoHS-compliant, it remains a robust solution for industrial, telecom, and embedded systems demanding precision and durability. Engineers will appreciate its balance of performance, size, and cost in space-constrained, thermally challenging designs.