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GS7B021820JCT
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GS7B021820JCT Description
GS7B021820JCT Description
The GS7B021820JCT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 14-pin narrow SOIC (SOIC-C series) device integrates 13 bussed resistors, each with a 182Ω resistance value and a ±5% absolute tolerance, ensuring reliable signal distribution in bus-oriented designs. Built with thin-film technology, it offers a low ±50ppm/°C temperature coefficient, enhancing stability across its operating range of -70°C to +125°C. The 0.05W (1/20) power rating per resistor and 100V maximum voltage rating make it suitable for low-power, high-voltage environments. Its gull-wing termination and surface-mount design facilitate easy PCB integration, while the ceramic case ensures durability and thermal performance.
GS7B021820JCT Features
- Bussed Network: 13 resistors connected in a bus configuration for simplified circuit design.
- Precision Tolerance: ±5% absolute tolerance and ±0.25% ratio tolerance for consistent performance.
- Robust Construction: Ceramic SOIC package with 1.45mm height and 5.99mm × 8.66mm footprint, compliant with tight space constraints.
- Wide Temperature Range: Operates reliably from -70°C to +125°C with derated power up to 125°C.
- Low TCR: ±50ppm/°C ensures minimal resistance drift under thermal stress.
- Surface-Mount Ready: 1.27mm terminal pitch and gull-wing leads for automated assembly.
GS7B021820JCT Applications
Ideal for industrial control systems, telecommunications hardware, and automotive electronics (though not PPAP/Automotive certified), this resistor network excels in:
- Voltage Division: Precision dividers in sensor interfaces.
- Bus Termination: Signal integrity in high-speed data lines.
- Power Management: Low-power distribution in compact PCBs.
- Medical Devices: Stable performance in diagnostic equipment.
Conclusion of GS7B021820JCT
The GS7B021820JCT combines high-density integration, thermal resilience, and electrical precision, making it a standout choice for engineers prioritizing reliability in space-constrained, thermally variable environments. Its ceramic thin-film construction and bussed architecture offer a competitive edge over polymer-based networks, particularly in applications requiring long-term stability and low drift. While not RoHS-compliant, its performance metrics justify its use in specialized industrial and communication systems.



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