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GS7B021871DT
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GS7B021871DT Description
GS7B021871DT Description
The GS7B021871DT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 14-pin narrow SOIC package, this bussed (BUS) configuration network integrates 13 thin-film resistors, each with a 1.87KΩ resistance and an exceptional ±0.5% absolute tolerance. The device operates over a wide temperature range of 70°C to 125°C (derated) with a ±50ppm/°C temperature coefficient, ensuring stability in fluctuating environments. Its SOIC-C series construction features a rectangular ceramic case, gull-wing termination, and surface-mount compatibility, making it ideal for compact PCB designs. With a maximum voltage rating of 100V and a total power rating of 0.7W (0.05W per resistor), it balances performance and reliability.
GS7B021871DT Features
- Precision Engineering: Thin-film technology delivers ±0.5% tolerance and ±50ppm/°C TCR for high-accuracy applications.
- Robust Construction: Ceramic substrate ensures thermal stability and durability in harsh conditions.
- Space-Efficient Design: 14-pin SOIC package (8.66mm x 5.99mm x 1.45mm) with 1.27mm terminal pitch optimizes board space.
- Bussed Configuration: Simplifies circuit design by connecting multiple resistors to a common node (BUS).
- Wide Operating Range: Supports -55°C to +125°C (full power) and derated up to 125°C.
- Surface-Mount Ready: Gull-wing leads facilitate automated assembly processes.
GS7B021871DT Applications
- Analog Signal Processing: Precision voltage dividers, gain networks in op-amp circuits.
- Industrial Electronics: PLCs, sensor interfaces, and control systems requiring stable resistance.
- Automotive (Non-Automotive Rated): Diagnostic equipment, infotainment systems (where PPAP compliance is not required).
- Test & Measurement: Calibration tools, reference circuits demanding low drift.
- Power Management: Current-limiting networks in low-power DC/DC converters.
Conclusion of GS7B021871DT
The GS7B021871DT excels in applications demanding tight tolerance, thermal stability, and compact form factors. Its ceramic thin-film construction and bussed architecture offer superior performance over standard thick-film networks, particularly in precision analog and industrial systems. While not PPAP or automotive-qualified, it remains a cost-effective solution for high-reliability commercial and industrial designs. Engineers will appreciate its balance of accuracy, power handling, and space savings, making it a versatile choice for modern electronics.



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