TT Electronics/IRC

GS7B022202FT

GS7B022202FT Description

The GS7B022202FT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 14-pin narrow SOIC device integrates 13 bussed resistors, each with a 22KΩ resistance and a tight ±1% tolerance. Built using thin-film technology, it delivers excellent stability with a low ±50ppm/°C temperature coefficient. The SOIC-C series package features a rectangular ceramic case, ensuring robust thermal and mechanical performance. Rated for 0.05W (1/20W) per resistor and 0.7W total power, it operates reliably across a wide temperature range of -70°C to +125°C, with a maximum voltage rating of 100V. Its gull-wing termination and 1.27mm terminal pitch facilitate easy surface-mount assembly.

GS7B022202FT Features

• 13 bussed resistors in a 14-pin SOIC package, optimized for space-constrained designs.
• Ceramic substrate enhances thermal conductivity and durability.
• Thin-film technology ensures precision (±1%) and low TCR (±50ppm/°C).
• High power handling: 0.7W total (0.05W per resistor) at 125°C derated power.
• Wide operating range: -70°C to +125°C, suitable for harsh environments.
• Gull-wing leads and 1.27mm pitch for reliable SMT compatibility.
• Non-automotive and non-PPAP compliant, ideal for industrial/consumer electronics.

GS7B022202FT Applications

This resistor network excels in precision analog circuits, voltage dividers, and bus termination applications. Its low TCR and high stability make it ideal for:

• Medical devices requiring consistent signal conditioning.
• Test and measurement equipment demanding accuracy over temperature fluctuations.
• Industrial control systems where reliability under thermal stress is critical.
• Communication hardware (e.g., RF modules) needing stable impedance matching.

Conclusion of GS7B022202FT

The GS7B022202FT stands out for its ceramic construction, thin-film precision, and robust thermal performance. While not RoHS-compliant, its bussed design and high power density make it a superior choice for engineers prioritizing long-term stability in demanding environments. Its SOIC footprint balances compactness with ease of assembly, catering to both prototyping and volume production. For applications requiring tight-tolerance, temperature-resistant networks, this model offers a compelling blend of reliability and performance.