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GS7B022210BBT
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GS7B022210BBT Description
GS7B022210BBT Description
The GS7B022210BBT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding applications requiring tight tolerance and stability. This 14-pin narrow SOIC device features 13 bussed resistors with a 221Ω resistance value, offering an absolute tolerance of ±0.1% and a ratio tolerance of ±0.1%. Built using thin-film technology, it delivers excellent performance with a low temperature coefficient of ±50ppm/°C, ensuring minimal resistance drift across its operating temperature range of 70°C to 125°C. The SOIC package (8.66mm x 5.99mm x 1.45mm) with gull-wing terminations ensures reliable surface-mount assembly, while its ceramic case style enhances thermal and mechanical durability.
GS7B022210BBT Features
- Precision Performance: ±0.1% absolute and ratio tolerance for critical circuit matching.
- Stable Thin-Film Technology: Low TCR (±50ppm/°C) ensures consistency under thermal stress.
- Robust Construction: Ceramic substrate and SOIC package for high reliability in harsh environments.
- High Voltage Handling: Supports up to 100V with a total power rating of 0.7W (0.05W per resistor).
- Automated Assembly Friendly: Gull-wing terminations and 1.27mm pitch simplify PCB mounting.
- Non-Automotive, Non-PPAP: Suitable for industrial and commercial applications where PPAP compliance is not required.
GS7B022210BBT Applications
This resistor network excels in precision analog and digital circuits, including:
- Voltage dividers and reference circuits in test/measurement equipment.
- Signal conditioning for sensors and data acquisition systems.
- Impedance matching in communication hardware.
- Medical devices requiring stable, high-accuracy passive components.
- Industrial control systems where temperature stability and long-term reliability are critical.
Conclusion of GS7B022210BBT
The GS7B022210BBT stands out for its exceptional precision, thermal stability, and robust ceramic construction, making it ideal for applications demanding tight tolerances and durability. While not suited for automotive use, its thin-film technology and SOIC packaging provide a reliable solution for industrial, medical, and communication systems. Engineers will appreciate its low TCR, high voltage rating, and ease of integration, ensuring consistent performance in mission-critical designs.



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