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GS7B022401FDT
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GS7B022401FDT Description
GS7B022401FDT Description
The GS7B022401FDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in a 14-pin narrow SOIC package, this bussed network integrates 13 thin-film resistors, each with a 2.4KΩ resistance and a tight ±1% absolute tolerance. The device operates over a wide temperature range (70°C to 125°C) with a low ±50ppm/°C temperature coefficient, ensuring stable performance in demanding environments. Its SOIC-C series construction offers excellent thermal and mechanical stability, while the gull-wing termination facilitates reliable surface-mount assembly. With a maximum voltage rating of 100V and a power rating of 0.7W (0.05W per resistor), this network is ideal for space-constrained, high-density PCB designs.
GS7B022401FDT Features
- Ceramic substrate for superior thermal management and durability.
- Thin-film technology ensures precision (±1% tolerance) and low TCR (±50ppm/°C).
- Bussed configuration simplifies circuit design by interconnecting resistors.
- 14-pin SOIC package (8.66mm x 5.99mm x 1.45mm) with ±0.1mm dimensional tolerances.
- Gull-wing leads for robust surface-mount compatibility (1.27mm pitch).
- Wide operating range: -55°C to +125°C (derated power up to 125°C).
- Non-automotive grade (PPAP: No), suitable for industrial and telecom applications.
GS7B022401FDT Applications
This resistor network excels in:
- Voltage division and current limiting in precision analog circuits.
- Signal conditioning for sensors, ADCs, and DACs in test/measurement equipment.
- Industrial control systems requiring stable resistance under thermal stress.
- Telecommunication infrastructure, where compact, high-reliability components are critical.
- Power management modules leveraging its 100V rating and low power dissipation.
Conclusion of GS7B022401FDT
The GS7B022401FDT stands out for its ceramic-based construction, tight tolerances, and bussed topology, making it a robust choice for precision electronics. While not RoHS-compliant, its thermal stability and thin-film accuracy cater to industrial and telecom needs where reliability outweighs regulatory constraints. Engineers will appreciate its space-saving SOIC footprint and consistent performance in harsh operating conditions.



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