TT Electronics/IRC

GS7B022490DDT

GS7B022490DDT Description

The GS7B022490DDT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Packaged in a 14-pin narrow SOIC (SOIC-C) format, this bussed network integrates 13 thin-film resistors with a 249Ω resistance value and an absolute tolerance of ±0.5%. Its ±50ppm/°C temperature coefficient ensures stable performance across a wide operating range of -70°C to +125°C, making it suitable for environments with thermal fluctuations. The 0.05W (1/20) power rating per resistor and 0.7W total power rating provide reliable power dissipation, while the 100V maximum voltage rating enhances versatility in circuit designs.

GS7B022490DDT Features

• Precision & Stability: ±0.5% tolerance and ±50ppm/°C TCR ensure accuracy in critical applications.
• Robust Construction: Ceramic case and thin-film technology offer durability and long-term reliability.
• Compact Design: 8.66mm × 5.99mm × 1.45mm dimensions with gull-wing terminations for space-efficient surface-mount (SMD) integration.
• Thermal Resilience: Operates up to 125°C with derated power capabilities.
• Bussed Configuration: Simplifies circuit design by connecting multiple resistors in a shared topology.
• Non-Automotive Grade: Ideal for industrial and commercial applications where PPAP compliance is not required.

GS7B022490DDT Applications

This resistor network excels in:

• Precision analog circuits (e.g., sensor interfaces, signal conditioning).
• Voltage division networks in test/measurement equipment.
• Embedded systems requiring stable reference resistances.
• Power management modules where thermal derating is critical.
• Industrial control systems benefiting from its EU RoHS non-compliant (lead-containing) construction for legacy designs.

Conclusion of GS7B022490DDT

The GS7B022490DDT stands out for its combination of precision, compactness, and thermal performance, making it a preferred choice for engineers designing high-reliability electronics. While not suited for automotive use, its ceramic thin-film architecture and bussed topology deliver superior performance in industrial, medical, and instrumentation applications where accuracy and stability are paramount. Its SOIC package ensures compatibility with standard PCB assembly processes, further enhancing its practicality.