TT Electronics/IRC

GS7B022612JDT

GS7B022612JDT Description

The GS7B022612JDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. Housed in a 14-pin narrow SOIC package, this bussed network integrates 13 thin-film resistors, each with a 26.1kΩ resistance and a ±5% absolute tolerance. The device operates over a wide temperature range of -70°C to +125°C, with a derated power capability up to 125°C, ensuring reliability in harsh environments. Its ±50ppm/°C temperature coefficient and ±0.5% ratio tolerance make it ideal for applications requiring stable resistance values under thermal stress. The SOIC-C series construction features a rectangular ceramic case, gull-wing termination, and surface-mount compatibility, offering robust mechanical and electrical performance.

GS7B022612JDT Features

• 13 bussed resistors in a 14-pin SOIC package, optimized for space-constrained designs.
• Thin-film technology ensures high precision with ±5% tolerance and ±50ppm/°C thermal stability.
• Ceramic substrate enhances thermal dissipation and durability.
• 0.05W (1/20) power rating per resistor, with a total power rating of 0.7W.
• 100V maximum voltage rating, suitable for industrial and automotive-grade circuits.
• Surface-mount (SMD) design with 1.27mm terminal pitch for easy PCB integration.
• Compact dimensions: 8.66mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• Non-automotive and non-PPAP compliant, targeting general industrial use.

GS7B022612JDT Applications

This resistor network excels in:

• Voltage division and signal conditioning in precision analog circuits.
• Sensor interfaces where stable resistance ratios (±0.5%) are critical.
• Industrial control systems requiring high-temperature operation (up to 125°C).
• Power management modules leveraging its 100V rating and ceramic thermal performance.
• Test and measurement equipment demanding low TCR (±50ppm/°C) and repeatability.

Conclusion of GS7B022612JDT

The GS7B022612JDT combines high-density integration, thermal resilience, and precision thin-film performance in a compact SOIC package. Its bussed architecture simplifies circuit design, while the ceramic construction ensures long-term reliability. Though not automotive-grade, it is a cost-effective solution for industrial, instrumentation, and power electronics where stability and space efficiency are paramount. Engineers will appreciate its balance of tolerance accuracy, thermal characteristics, and ease of assembly, making it a versatile choice for modern SMD applications.