TT Electronics/IRC

GS7B022740JT

GS7B022740JT Description

The GS7B022740JT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. This 14-pin narrow SOIC package features 13 bussed resistors with a 274Ω resistance value and a ±5% tolerance, ensuring reliable performance in circuit designs requiring consistent impedance matching. Built with thin-film technology, it offers a low ±50ppm/°C temperature coefficient, maintaining stability across a wide operating temperature range of -55°C to +125°C. The SOIC-C series construction provides robust mechanical durability, while the gull-wing termination enables secure surface-mount (SMD) assembly. With a maximum voltage rating of 100V and a power rating of 0.7W (0.05W per resistor), this network is ideal for compact, high-density PCB layouts.

GS7B022740JT Features

• Ceramic substrate for enhanced thermal and mechanical stability.
• Bussed (BUS) configuration simplifies circuit design by interconnecting resistors.
• Thin-film technology ensures precision (±5%) and low TCR (±50ppm/°C).
• 14-pin SOIC package (8.66mm × 5.99mm × 1.45mm) with ±0.1mm length/height tolerances for consistent mounting.
• Wide temperature range (-55°C to +125°C) with derated power up to 125°C.
• Gull-wing leads (1.27mm pitch) for reliable SMD soldering.
• Non-automotive, non-PPAP compliant, suited for industrial and commercial applications.

GS7B022740JT Applications

This resistor network excels in:

• Voltage division and pull-up/down circuits in digital systems.
• Signal conditioning for sensors and ADCs in measurement equipment.
• Impedance matching in communication interfaces (e.g., RS-485, CAN bus).
• Power supply decoupling and bias networks in embedded systems.
• Industrial control systems requiring stable resistance under thermal stress.

Conclusion of GS7B022740JT

The GS7B022740JT combines precision, durability, and compact design, making it a superior choice for engineers needing reliable resistor networks in space-constrained, thermally variable environments. Its ceramic construction, thin-film accuracy, and bussed topology reduce component count and simplify layout, while the SOIC package ensures compatibility with automated assembly processes. Ideal for industrial electronics, test equipment, and communication hardware, this model stands out for its balance of performance and cost-effectiveness in non-automotive applications.