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GS7B022742FAT
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GS7B022742FAT Description
GS7B022742FAT Description
The GS7B022742FAT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. This 14-pin Narrow SOIC device features 13 bussed resistors with a 27.4KΩ resistance value and an absolute tolerance of ±1%, ensuring consistent performance. Built with thin-film technology, it offers a low temperature coefficient of ±50ppm/°C, maintaining stability across a wide operating temperature range of -55°C to +125°C. The SOIC package (8.66mm x 5.99mm x 1.45mm) is optimized for surface-mount assembly, with gull-wing terminations for reliable PCB connections. Rated for 100V maximum voltage and 0.7W total power dissipation, it is ideal for precision analog and digital circuits.
GS7B022742FAT Features
- High Precision: ±1% absolute tolerance and ±0.05% ratio tolerance for matched resistance values.
- Stable Performance: ±50ppm/°C tempco ensures minimal drift in varying environments.
- Robust Construction: Ceramic substrate enhances thermal and mechanical durability.
- Space-Efficient: Compact SOIC-C Series footprint (8.66mm x 5.99mm) suits high-density PCB layouts.
- Bussed Configuration: Simplifies circuit design by interconnecting multiple resistors.
- Wide Voltage Range: Supports up to 100V, making it suitable for industrial and automotive (non-AEC-Q200) applications.
- Surface-Mount Ready: Gull-wing leads with 1.27mm pitch facilitate automated assembly.
GS7B022742FAT Applications
This resistor network excels in:
- Precision voltage dividers and signal conditioning circuits in test/measurement equipment.
- Analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) requiring matched resistances.
- Industrial control systems where thermal stability and reliability are critical.
- Medical electronics due to its low drift and consistent performance.
- Telecommunication infrastructure for impedance matching and termination networks.
Conclusion of GS7B022742FAT
The GS7B022742FAT combines high accuracy, thermal resilience, and compact design, making it a superior choice for precision electronics. Its bussed architecture reduces component count, while thin-film technology ensures long-term stability. Though not PPAP or automotive-qualified, it is well-suited for industrial, medical, and telecom applications demanding tight tolerances and low drift. Engineers will appreciate its balance of performance and manufacturability in space-constrained designs.



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