TT Electronics/IRC

GS7B022801BAT

GS7B022801BAT Description

The GS7B022801BAT from TT Electronics/IRC is a high-precision ceramic thin-film resistor network designed for demanding electronic applications. Housed in a 14-pin narrow SOIC package, this bussed (BUS) network integrates 13 resistors, each with a 2.8KΩ resistance and an exceptional ±0.1% absolute tolerance (±0.05% ratio tolerance). Its thin-film technology ensures stable performance with a low ±50ppm/°C temperature coefficient, making it ideal for precision circuits. The device operates over a wide temperature range (-70°C to +125°C) and supports a maximum voltage rating of 100V, with a total power rating of 0.7W (0.05W per resistor). The gull-wing termination and surface-mount design facilitate easy PCB integration.

GS7B022801BAT Features

• High Precision: ±0.1% tolerance and ±50ppm/°C TCR for stable performance in critical applications.
• Robust Construction: Ceramic case and thin-film technology ensure durability and long-term reliability.
• Compact Form Factor: SOIC package (8.66mm x 5.99mm x 1.45mm) with tight tolerances (±0.1mm length/height).
• Wide Operating Range: Functions reliably from -70°C to +125°C, even at derated power.
• Bussed Configuration: Simplifies circuit design by interconnecting resistors in a single network.
• Surface-Mount Ready: Gull-wing terminals with 1.27mm pitch for efficient assembly.

GS7B022801BAT Applications

This resistor network excels in precision analog circuits, signal conditioning, and voltage division applications, particularly where space and accuracy are critical. Key use cases include:

• Medical Devices: High-accuracy sensor interfaces and instrumentation amplifiers.
• Industrial Automation: Feedback networks in control systems and DAC/ADC circuits.
• Telecommunications: Impedance matching and filtering in RF modules.
• Automotive (Non-Automotive Rated): Non-safety-critical systems requiring stable resistance under thermal stress.

Conclusion of GS7B022801BAT

The GS7B022801BAT stands out for its precision, compactness, and thermal stability, making it a superior choice for engineers designing high-reliability electronics. While not PPAP or automotive-qualified, its ceramic construction and tight tolerances make it ideal for industrial, medical, and telecom applications where performance cannot be compromised. For designs requiring bussed networks with minimal drift, this model delivers unmatched consistency in a space-efficient package.