TT Electronics/IRC

GS7B022870JFT

GS7B022870JFT Description

The GS7B022870JFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding electronic circuits. This 14-pin narrow SOIC package features 13 bussed resistors with a 287Ω resistance value, offering a ±5% absolute tolerance and ±1% ratio tolerance for consistent performance. Built with thin-film technology, it delivers excellent stability with a ±50ppm/°C temperature coefficient, ensuring reliable operation across a wide temperature range of -70°C to +125°C. The SOIC-C series construction provides robust surface-mount compatibility, with a compact footprint (8.66mm × 5.99mm × 1.45mm) and gull-wing termination for secure PCB attachment. Rated for 100V maximum voltage and 0.7W total power dissipation, this network is ideal for high-density designs requiring precision and durability.

GS7B022870JFT Features

• 13 bussed resistors in a 14-pin SOIC package, optimized for space-constrained layouts.
• Thin-film technology ensures low noise, high stability, and ±50ppm/°C thermal performance.
• Ceramic case enhances thermal management and mechanical robustness.
• 5% absolute tolerance and 1% ratio tolerance for precision signal conditioning.
• Wide operating range (-70°C to +125°C) with derated power up to 125°C.
• Gull-wing terminals and 1.27mm pitch for reliable surface-mount assembly.
• Non-automotive and non-PPAP compliant, suited for industrial and commercial use.

GS7B022870JFT Applications

This resistor network excels in:

• Voltage division and bus termination in digital communication systems (e.g., CAN, SPI).
• Signal conditioning for ADCs, DACs, and sensor interfaces.
• Power supply feedback networks requiring tight tolerance ratios.
• Industrial control systems where temperature stability and compactness are critical.
• Medical and test equipment demanding high reliability and low drift.

Conclusion of GS7B022870JFT

The GS7B022870JFT combines precision, compactness, and thermal resilience, making it a standout choice for engineers designing high-reliability circuits. Its bussed architecture, thin-film construction, and tight tolerances address challenges in signal integrity and power distribution, while the SOIC package ensures compatibility with automated assembly processes. Though not RoHS-compliant, its performance-centric design justifies its use in specialized industrial and instrumentation applications where accuracy and durability are paramount.