TT Electronics/IRC

GS7B022871JDT

GS7B022871JDT Description

The GS7B022871JDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in a 14-pin narrow SOIC package, it features 13 bussed resistors with a 2.87KΩ resistance value and a ±5% absolute tolerance. The thin-film technology ensures stable performance with a low ±50ppm/°C temperature coefficient, making it suitable for environments with operating temperatures ranging from 70°C to 125°C. With a power rating of 0.7W (0.05W per resistor) and a maximum voltage rating of 100V, this network is engineered for reliability in demanding circuits.

GS7B022871JDT Features

• Bussed Circuit Design: Simplifies PCB layout by connecting multiple resistors in a single package.
• High Power Handling: 0.7W total power dissipation (0.05W per resistor) ensures durability.
• Precision Tolerance: ±5% absolute tolerance and ±0.5% ratio tolerance for consistent performance.
• Robust Construction: Ceramic case and gull-wing termination provide mechanical and thermal stability.
• Surface-Mount Compatibility: SOIC package (8.66mm x 5.99mm x 1.45mm) with 1.27mm terminal pitch for easy integration.
• Wide Temperature Range: Operates reliably from -55°C to 125°C (derated power at 70°C to 125°C).

GS7B022871JDT Applications

This resistor network is ideal for:

• Voltage divider circuits in industrial control systems.
• Signal conditioning in automotive and aerospace electronics (non-automotive grade).
• Bus termination for high-speed digital communication interfaces.
• Precision analog circuits requiring stable resistance ratios.
• Embedded systems where space-saving and reliability are critical.

Conclusion of GS7B022871JDT

The GS7B022871JDT stands out for its high power density, precision tolerances, and robust ceramic construction, making it a superior choice for bussed resistor applications. While not PPAP or automotive-qualified, its thin-film technology and wide temperature range ensure performance in industrial, telecom, and embedded systems. Its compact SOIC package and ease of integration further enhance its appeal for designers seeking reliability in space-constrained environments.