TT Electronics/IRC

GS7B023402JDT

GS7B023402JDT Description

The GS7B023402JDT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications requiring stable resistance values and robust thermal performance. Housed in a 14-pin narrow SOIC package, this bussed network integrates 13 thin-film resistors, each with a 34KΩ resistance (±5% tolerance) and a ±50ppm/°C temperature coefficient. Its 0.05W (1/20) power rating per resistor and 0.7W total power handling ensure reliability in demanding environments. The device operates over a wide temperature range (-70°C to +125°C) and supports 100V maximum voltage, making it suitable for industrial and automotive-adjacent systems (though not PPAP or Automotive-qualified). The gull-wing termination and surface-mount design facilitate easy PCB integration.

GS7B023402JDT Features

• Ceramic SOIC-C Series: Offers superior thermal stability and mechanical durability compared to polymer-based networks.
• Bussed Configuration: Simplifies circuit design by connecting multiple resistors to a common node (BUS), reducing component count.
• Precision Thin Film: Delivers ±0.5% ratio tolerance for matched resistance pairs, critical for differential amplifiers or voltage dividers.
• Robust Construction: Rectangular ceramic case with tight dimensional tolerances (±0.1mm height, ±0.2mm depth) ensures consistent mounting.
• Non-RoHS Compliant: Suitable for legacy or niche applications where lead-free alternatives are not required.

GS7B023402JDT Applications

• Signal Conditioning: Ideal for ADC/DAC reference networks due to low TCR and tight ratio tolerance.
• Industrial Controls: Used in PLC I/O modules where high-voltage isolation and thermal resilience are critical.
• Test & Measurement Equipment: Ensures accuracy in multichannel sensor interfaces or calibration circuits.
• Power Management: Bussed design suits voltage distribution in multi-rail DC/DC converters.

Conclusion of GS7B023402JDT

The GS7B023402JDT excels in precision analog circuits demanding stable, matched resistances under thermal stress. Its ceramic construction, bussed topology, and thin-film technology provide a competitive edge over epoxy-based networks in harsh environments. While not RoHS-compliant, it remains a cost-effective solution for industrial, instrumentation, and power systems where reliability outweighs regulatory constraints. Engineers will appreciate its ease of integration and consistent performance across temperature extremes.