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GS7B023481CAT
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GS7B023481CAT Description
GS7B023481CAT Description
The GS7B023481CAT from TT Electronics/IRC is a high-precision ceramic resistor network designed for demanding electronic applications. Housed in a 14-pin narrow SOIC package, this bussed (BUS) configuration network integrates 13 thin-film resistors, each with a 3.48KΩ resistance and an exceptional ±0.25% absolute tolerance (±0.05% ratio tolerance). Its ±50ppm/°C temperature coefficient ensures stability across a wide operating range of -70°C to +125°C, making it suitable for environments with thermal fluctuations. The SOIC-C series construction features a rectangular ceramic case with gull-wing terminations, optimized for surface-mount assembly. With a 0.7W total power rating (0.05W per resistor) and 100V maximum voltage rating, it balances compactness (8.66mm x 5.99mm x 1.45mm) with robust performance.
GS7B023481CAT Features
- Precision Engineering: Thin-film technology delivers ±0.25% tolerance and low TCR (±50ppm/°C) for critical analog circuits.
- Durable Construction: Ceramic substrate enhances thermal dissipation and mechanical strength vs. polymer-based networks.
- Space-Efficient: SOIC package (1.27mm pitch) saves PCB real estate while supporting high-density layouts.
- Wide Temperature Range: Operates reliably from -70°C to +125°C (derated power up to 125°C).
- Automation-Friendly: Gull-wing leads enable seamless pick-and-place assembly.
- Non-Automotive: Not PPAP-capable, ideal for industrial/telecom applications.
GS7B023481CAT Applications
- Precision Voltage Dividers: Used in ADC/DAC reference circuits where ratio tolerance (±0.05%) is critical.
- Sensor Signal Conditioning: Stable resistance in temperature sensors or bridge networks.
- Medical Equipment: High-reliability networks for patient monitoring devices.
- Test & Measurement: Calibration modules requiring low drift over temperature.
- Industrial Controls: PLC analog I/O boards benefiting from compact, high-power designs.
Conclusion of GS7B023481CAT
The GS7B023481CAT excels in applications demanding tight tolerance, thermal stability, and compact form factors. Its ceramic SOIC-C package and bussed architecture offer superior performance over plastic-encapsulated networks, particularly in harsh environments. While not automotive-grade, it is a cost-effective solution for industrial, medical, and precision instrumentation designs. Engineers will value its repeatable accuracy and ease of integration, reducing calibration overhead and boosting system reliability.



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