TT Electronics/IRC

GS7B023602GFT

GS7B023602GFT Description

The GS7B023602GFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. This 14-pin Narrow SOIC device features 13 bussed resistors with a 36KΩ resistance value and a tight ±2% absolute tolerance, ensuring reliable signal conditioning and voltage division. Built with thin-film technology, it delivers excellent stability with a low ±50ppm/°C temperature coefficient, making it suitable for temperature-sensitive circuits. The SOIC package (8.66mm × 5.99mm × 1.45mm) offers a compact footprint, while its ceramic case enhances thermal and mechanical durability. Rated for 100V maximum voltage and 0.7W total power dissipation, it operates across a wide temperature range (-70°C to +125°C).

GS7B023602GFT Features

• Bussed Network Design: 13 resistors connected in a bus configuration for simplified PCB layout.
• High Precision: ±2% absolute tolerance and ±1% ratio tolerance for accurate signal processing.
• Robust Construction: Ceramic substrate with gull-wing termination ensures reliability in harsh conditions.
• Low TCR: ±50ppm/°C minimizes resistance drift over temperature.
• Surface-Mount Compatibility: 1.27mm terminal pitch for easy integration into high-density designs.
• Derated Power Handling: Supports 0.05W per resistor (1/20W) with derating up to 125°C.
• Non-Automotive Grade: Ideal for industrial, telecom, and instrumentation applications.

GS7B023602GFT Applications

• Voltage Dividers: Precision attenuation in sensor interfaces or ADC circuits.
• Signal Conditioning: Buffering and impedance matching in communication systems.
• Industrial Controls: Durable performance in PLCs, motor drives, and power supplies.
• Test & Measurement Equipment: Stable resistance networks for calibration and reference circuits.
• Aerospace & Defense: Reliable operation in extended temperature environments.

Conclusion of GS7B023602GFT

The GS7B023602GFT excels in applications requiring compact size, precision, and thermal stability. Its ceramic thin-film construction and bussed architecture provide superior performance over standard thick-film networks, particularly in high-reliability systems. While not PPAP or automotive-qualified, it is a cost-effective solution for industrial and telecom designs where low TCR and tight tolerances are critical. Engineers will appreciate its balance of performance, durability, and ease of integration in space-constrained PCBs.