TT Electronics/IRC

GS7B023651GBT

GS7B023651GBT Description

The GS7B023651GBT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Housed in a 14-pin narrow SOIC package, this bussed (BUS) configuration features 13 thin-film resistors, each with a 3.65KΩ resistance and a tight ±2% absolute tolerance. The device operates over a wide temperature range of -70°C to +125°C, with a derated power capability up to 125°C, ensuring reliability in demanding environments. Its ±50ppm/°C temperature coefficient and ±0.1% ratio tolerance make it ideal for applications requiring stable, matched resistance values. The SOIC-C series construction offers robust ceramic case durability, while the gull-wing termination facilitates easy surface-mount (SMD) assembly.

GS7B023651GBT Features

• Precision Network: 13 resistors, 3.65KΩ ±2%, with ±0.1% ratio tolerance for matched performance.
• High-Temperature Stability: ±50ppm/°C TCR ensures minimal drift across -70°C to +125°C.
• Robust Construction: Ceramic SOIC package (8.66mm x 5.99mm x 1.45mm) with ±0.1mm height tolerance.
• Power Handling: 0.7W total (0.05W per resistor) and 100V max rating.
• Surface-Mount Ready: Gull-wing leads with 1.27mm pitch for automated PCB assembly.
• Non-Automotive: Suitable for industrial, telecom, and instrumentation use (PPAP/automotive not supported).

GS7B023651GBT Applications

This resistor network excels in:

• Voltage Divider Circuits: Precision ratio tolerance (±0.1%) ensures accurate signal conditioning.
• Industrial Control Systems: Stable performance under thermal stress (-70°C to +125°C).
• Telecom Hardware: Thin-film technology minimizes noise in high-frequency applications.
• Test & Measurement Equipment: Tight tolerances and low TCR critical for calibration.
• Power Management Modules: Bussed design simplifies bus line termination.

Conclusion of GS7B023651GBT

The GS7B023651GBT combines precision, durability, and thermal resilience in a compact SOIC format. Its ceramic thin-film construction and low TCR outperform plastic-based networks in harsh environments, while the bussed topology reduces component count in bus-oriented designs. Though not RoHS-compliant or automotive-grade, it is a cost-effective solution for industrial, telecom, and precision electronics requiring stable, matched resistances. Ideal for engineers prioritizing reliability, space savings, and ease of assembly.