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GS7B023651JCT
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GS7B023651JCT Description
GS7B023651JCT Description
The GS7B023651JCT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 14-pin narrow SOIC device features 13 bussed resistors with a 3.65KΩ resistance value and a ±5% absolute tolerance, ensuring reliable performance in demanding circuits. Built with thin-film technology, it offers a low ±50ppm/°C temperature coefficient, enhancing stability across a wide operating range of -70°C to +125°C. The SOIC package (8.66mm x 5.99mm x 1.45mm) with gull-wing terminations ensures easy surface-mount integration, while its 0.05W (1/20) power rating per resistor and 100V maximum voltage rating make it suitable for low-power, high-voltage environments.
GS7B023651JCT Features
- Bussed Network Design: Simplifies circuit layout with 13 interconnected resistors.
- High Precision: ±5% tolerance and ±0.25% ratio tolerance for consistent performance.
- Robust Construction: Ceramic case and thin-film technology ensure durability and thermal stability.
- Wide Temperature Range: Operates reliably from -70°C to +125°C with derated power.
- Compact & Reliable: SOIC package (8.66mm x 5.99mm) with ±0.1mm length/height tolerances for precise PCB placement.
- Low TCR: ±50ppm/°C minimizes resistance drift in varying environments.
GS7B023651JCT Applications
Ideal for industrial, automotive (non-AECQ), and instrumentation applications requiring stable, compact resistor networks. Key use cases include:
- Voltage Divider Networks: Precision signal conditioning in sensor interfaces.
- Bus Termination: Reliable impedance matching in communication systems.
- Analog Signal Processing: Low-noise, stable resistance for op-amp circuits.
- Power Management: Derated power handling in DC-DC converters.
Conclusion of GS7B023651JCT
The GS7B023651JCT combines precision, compactness, and thermal resilience, making it a standout choice for engineers needing high-density resistor networks with low TCR and tight tolerances. Its bussed design reduces component count, while the ceramic SOIC package ensures longevity in harsh environments. While not automotive-grade (PPAP No), it excels in industrial and instrumentation applications where reliability and space efficiency are critical.



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