TT Electronics/IRC

GS7B023901GFT

GS7B023901GFT Description

The GS7B023901GFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 14-pin narrow SOIC device features 13 bussed resistors with a 3.9KΩ resistance value and a tight ±2% absolute tolerance, ensuring reliable performance in demanding circuits. Built with thin-film technology, it offers excellent stability with a low ±50ppm/°C temperature coefficient, making it ideal for environments with fluctuating temperatures. The SOIC package (8.66mm × 5.99mm × 1.45mm) is optimized for surface-mount assembly, with gull-wing terminations for robust solder joints. Rated for 100V maximum voltage and 0.7W total power dissipation, it operates reliably from 70°C to 125°C under derated conditions.

GS7B023901GFT Features

• Bussed Network Design: Simplifies PCB layout by connecting multiple resistors to a common node.
• High Precision: ±2% absolute tolerance and ±1% ratio tolerance for matched performance.
• Stable Thin-Film Construction: Delivers low noise and excellent long-term reliability.
• Wide Temperature Range: Operates up to 125°C with derated power handling.
• Compact SOIC Package: Space-saving footprint (8.66mm × 5.99mm) with 1.27mm terminal pitch.
• Non-Automotive Grade: Suitable for industrial, telecom, and instrumentation applications.

GS7B023901GFT Applications

This resistor network excels in:

• Voltage Divider Circuits: Precision ratio tolerance ensures accurate signal conditioning.
• Bus Termination Networks: Ideal for digital systems requiring stable impedance matching.
• Sensor Interface Modules: Low TCR minimizes drift in temperature-sensitive designs.
• Industrial Control Systems: Robust ceramic construction withstands harsh environments.
• Test & Measurement Equipment: High repeatability and low noise enhance signal integrity.

Conclusion of GS7B023901GFT

The GS7B023901GFT combines precision, compactness, and thermal stability, making it a standout choice for engineers designing high-reliability analog and mixed-signal systems. Its bussed architecture reduces component count, while the thin-film technology ensures consistent performance across temperature variations. While not PPAP or RoHS compliant, it remains a cost-effective solution for industrial and telecom applications where precision and durability are critical. For designs requiring tight-tolerance resistor networks in a space-constrained SOIC package, this model delivers exceptional value.