TT Electronics/IRC

GS7B023902GT

GS7B023902GT Description

The GS7B023902GT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 14-pin narrow SOIC device features 13 bussed resistors with a 39 kΩ resistance value and a tight ±2% tolerance, ensuring reliable performance in demanding circuits. Built with thin-film technology, it offers a low ±50 ppm/°C temperature coefficient, enhancing stability across a wide operating temperature range of -70°C to +125°C. The SOIC package (8.66 x 5.99 x 1.45 mm) with gull-wing terminations ensures compatibility with automated surface-mount assembly processes. Rated for 100V maximum voltage and 0.7W total power dissipation, it is ideal for space-constrained designs requiring consistent resistance matching.

GS7B023902GT Features

• Ceramic substrate for superior thermal and mechanical stability.
• Bussed network topology simplifies PCB layout in bus-oriented designs.
• Thin-film technology ensures low noise and high precision (±2% tolerance).
• Wide temperature range (-70°C to +125°C) with derated power up to 125°C.
• 14-pin SOIC package (narrow profile) with 1.27mm terminal pitch for high-density mounting.
• Gull-wing terminations for reliable solder joints in SMT applications.
• Non-automotive and non-PPAP compliant, suited for industrial and commercial use.
• Non-RoHS (legacy applications requiring leaded components).

GS7B023902GT Applications

• Voltage division and pull-up/down networks in digital systems.
• Signal conditioning for sensors and analog circuits.
• Bus termination in communication interfaces (e.g., I2C, SPI).
• Industrial control systems requiring stable resistance under thermal stress.
• Legacy electronics where leaded components are mandated.

Conclusion of GS7B023902GT

The GS7B023902GT excels in precision applications demanding thermal stability, compact packaging, and matched resistance values. Its ceramic construction and thin-film technology provide durability and accuracy, while the bussed design reduces component count in bus architectures. Though not suited for automotive use, it is a robust choice for industrial, telecom, and legacy systems requiring high-voltage tolerance and consistent performance across temperature extremes. Engineers will appreciate its balance of reliability, density, and ease of integration in surface-mount designs.