TT Electronics/IRC

GS7B024700FBT

GS7B024700FBT Description

The GS7B024700FBT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Packaged in a 14-pin narrow SOIC (SOIC-C series), it features 13 bussed resistors with a 470Ω resistance value and a tight ±1% absolute tolerance. The thin-film technology ensures excellent stability with a low ±50ppm/°C temperature coefficient, making it ideal for environments with operating temperatures up to 125°C. The 0.05W (1/20) power rating per resistor and 0.7W total power rating provide reliable performance in compact designs. With a 100V maximum voltage rating, gull-wing termination, and surface-mount compatibility, this network is optimized for automated assembly.

GS7B024700FBT Features

• Bussed network topology simplifies circuit design by connecting multiple resistors to a common node.
• Ceramic case (SOIC package) ensures durability and thermal stability.
• Thin-film technology delivers superior precision (±1% tolerance) and low TCR (±50ppm/°C).
• Compact dimensions: 8.66mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm L/H, ±0.2mm D).
• 1.27mm terminal pitch for high-density PCB layouts.
• Non-automotive (PPAP: No) but suitable for industrial and telecom applications.
• Non-RoHS compliant, requiring careful material selection for regulated markets.

GS7B024700FBT Applications

This resistor network excels in:

• Voltage division and pull-up/down circuits in digital systems.
• Signal conditioning for sensors and ADCs in measurement equipment.
• Industrial control systems requiring stable, high-temperature operation.
• Telecommunications hardware where space efficiency and reliability are critical.
• Power management modules leveraging its 100V rating and low thermal drift.

Conclusion of GS7B024700FBT

The GS7B024700FBT stands out for its precision, compactness, and thermal resilience, making it a robust choice for high-density, temperature-sensitive designs. While not suited for automotive use, its bussed configuration and thin-film accuracy make it ideal for industrial, telecom, and instrumentation applications. Engineers will appreciate its balance of performance and ease of integration in space-constrained PCBs.