TT Electronics/IRC

GS7B024992JT

GS7B024992JT Description

The GS7B024992JT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. Packaged in a 14-pin narrow SOIC (SOIC-C series), this bussed network integrates 13 thin-film resistors, each with a 49.9KΩ resistance and a ±5% tolerance. The device operates over a wide temperature range of -70°C to +125°C, with a derated power capability up to 125°C. Its ±50ppm/°C temperature coefficient ensures stable performance in varying thermal conditions. The SOIC package (8.66mm x 5.99mm x 1.45mm) features gull-wing terminations with a 1.27mm pitch, optimized for surface-mount assembly. With a maximum voltage rating of 100V and a total power rating of 0.7W (0.05W per resistor), it is ideal for space-constrained, high-reliability designs.

GS7B024992JT Features

• Ceramic substrate for enhanced thermal stability and durability.
• Thin-film technology delivers precision (±5%) and low TCR (±50ppm/°C).
• Bussed circuit design simplifies PCB layout in multi-resistor applications.
• 14-pin SOIC package with gull-wing leads for robust SMT compatibility.
• Wide operating range (-70°C to +125°C) with derated power at elevated temperatures.
• High voltage tolerance (100V) and low crosstalk between resistors.
• Non-automotive grade (PPAP: No) but suitable for industrial and telecom applications.

GS7B024992JT Applications

• Signal conditioning in data acquisition systems.
• Voltage division and pull-up/down networks in digital circuits.
• Impedance matching for RF and communication modules.
• Industrial control systems requiring stable resistance under thermal stress.
• Medical electronics where precision and reliability are critical.
• Power management circuits in consumer and telecom hardware.

Conclusion of GS7B024992JT

The GS7B024992JT excels in precision, thermal performance, and space efficiency, making it a superior choice for high-density PCBs and harsh environments. Its ceramic construction, thin-film resistors, and bussed architecture offer distinct advantages over polymer-based networks, particularly in thermal drift sensitivity and long-term stability. While not RoHS-compliant, it remains a robust solution for industrial, medical, and telecom applications demanding tight tolerances and reliability. Engineers will appreciate its balance of performance, size, and cost in critical designs.