
TT Electronics/IRC
GS7B025112JT
Why Choose Us?
Professional Platform
B2B & B2C purchasingDelivery at full speed
1-2 days deliveryWide variety
Original manufacturers365 days guarantee
Responsible qualityTech Specifications
GS7B025112JT Description
GS7B025112JT Description
The GS7B025112JT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. Housed in a 14-pin narrow SOIC package, this bussed network integrates 13 thin-film resistors, each with a 51.1KΩ resistance and a ±5% tolerance. The device operates over a wide temperature range of 70°C to 125°C with a derated power capability, ensuring reliability under thermal stress. Its ±50ppm/°C temperature coefficient and 100V maximum voltage rating make it suitable for stable, low-drift circuits. The SOIC-C series construction features a rectangular ceramic case with gull-wing terminations, optimized for surface-mount assembly.
GS7B025112JT Features
- Robust Construction: Ceramic substrate enhances thermal stability and mechanical durability.
- Precision Performance: Thin-film technology delivers ±50ppm/°C TCR and 5% tolerance for consistent operation.
- High-Density Integration: 13 resistors in a compact 8.66mm × 5.99mm footprint, saving PCB space.
- Wide Operating Range: Rated for 125°C max temperature and 0.7W total power dissipation.
- Automation-Friendly: Gull-wing leads with 1.27mm pitch simplify pick-and-place assembly.
- Non-Automotive: Not PPAP-capable, ideal for industrial/commercial use.
GS7B025112JT Applications
This resistor network excels in:
- Voltage Division: Precision ladder networks in ADC/DAC circuits.
- Signal Conditioning: Pull-up/pull-down arrays for digital buses (e.g., I²C, SPI).
- Industrial Controls: Stable reference networks in PLCs and sensor interfaces.
- Power Management: Load sharing in low-power DC/DC converters.
- Test Equipment: Calibration circuits requiring low thermal drift.
Conclusion of GS7B025112JT
The GS7B025112JT combines ceramic reliability, thin-film precision, and high-density integration for critical analog designs. Its bussed architecture simplifies bus termination, while the SOIC package ensures compatibility with standard SMT processes. Though not RoHS-compliant or automotive-grade, it is a cost-effective solution for industrial, telecom, and instrumentation applications demanding stable performance over temperature. Engineers will appreciate its balance of size, accuracy, and power handling in space-constrained layouts.



.png)















.png?x-oss-process=image/format,webp/resize,h_32)










