TT Electronics/IRC

GS7B025230JT

GS7B025230JT Description

The GS7B025230JT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications in demanding environments. This 14-pin narrow SOIC package features 13 bussed resistors with a 523Ω resistance value and a ±5% tolerance, ensuring reliable signal conditioning and voltage division. Built with thin-film technology, it delivers stable performance across a wide temperature range (70°C to 125°C) and offers a low temperature coefficient of ±50ppm/°C, minimizing resistance drift. The SOIC-C series construction provides robust mechanical stability, with a compact footprint (8.66mm x 5.99mm x 1.45mm) and gull-wing termination for easy surface-mount assembly. Rated for 100V maximum voltage and 0.7W total power dissipation, it is ideal for space-constrained designs requiring high-density resistor arrays.

GS7B025230JT Features

• Ceramic substrate for superior thermal and mechanical durability.
• 13 bussed resistors in a 14-pin SOIC package, optimizing PCB space.
• Thin-film technology ensures precision (±5%) and low TCR (±50ppm/°C).
• Wide operating range: -55°C to +125°C (derated power up to 125°C).
• Surface-mount design with 1.27mm terminal pitch for automated assembly.
• High voltage rating (100V) and 0.05W per resistor power handling.
• Non-automotive and non-PPAP compliant, suited for industrial/consumer electronics.
• Tube packaging for secure handling and storage.

GS7B025230JT Applications

This resistor network excels in:

• Signal conditioning and pull-up/pull-down networks in digital circuits.
• Voltage dividers for ADC/DAC interfaces and sensor calibration.
• Industrial control systems requiring stable resistance under thermal stress.
• Consumer electronics (e.g., smart home devices, wearables) where compactness is critical.
• Power management modules leveraging its high-voltage tolerance.

Conclusion of GS7B025230JT

The GS7B025230JT stands out for its ceramic-based reliability, precision thin-film resistors, and space-saving SOIC footprint. While not RoHS-compliant, its thermal stability and bussed architecture make it a cost-effective solution for non-automotive applications. Engineers will appreciate its balance of performance, durability, and ease of integration in high-density PCB designs.