TT Electronics/IRC

GS7B025602GFT

GS7B025602GFT Description

The GS7B025602GFT from TT Electronics/IRC is a high-performance ceramic resistor network designed for precision applications. This 14-pin narrow SOIC device features 13 bussed resistors with a 56KΩ resistance value and a tight ±2% absolute tolerance, ensuring reliable performance in demanding circuits. Built with thin-film technology, it offers excellent stability with a low ±50ppm/°C temperature coefficient. The SOIC package provides robust mechanical protection while enabling surface-mount assembly with a 1.27mm terminal pitch. Rated for 100V maximum voltage and 0.05W (1/20) power dissipation per resistor, it operates across a wide temperature range of -55°C to +125°C, making it suitable for industrial and commercial environments.

GS7B025602GFT Features

• 13 bussed resistors in a 14-pin SOIC package for compact PCB layouts.
• Ceramic substrate ensures high thermal stability and durability.
• Thin-film technology delivers precision (±2% tolerance) and low TCR (±50ppm/°C).
• Gull-wing termination for reliable surface-mount soldering.
• 0.7W total power rating (0.05W per resistor) with derating up to 125°C.
• 100V maximum voltage rating for robust signal handling.
• Narrow SOIC (8.66mm × 5.99mm × 1.45mm) footprint optimizes board space.
• Non-automotive grade (PPAP: No) but suitable for industrial and telecom applications.

GS7B025602GFT Applications

• Voltage division networks in precision analog circuits.
• Pull-up/pull-down resistor arrays for digital logic interfaces.
• Signal conditioning in sensor modules and instrumentation.
• Industrial control systems requiring stable, high-density resistor networks.
• Telecom infrastructure where consistent performance under thermal stress is critical.

Conclusion of GS7B025602GFT

The GS7B025602GFT stands out for its ceramic construction, thin-film precision, and compact SOIC packaging, offering superior reliability in space-constrained designs. While not RoHS-compliant, its low TCR, high voltage tolerance, and bussed topology make it ideal for industrial, telecom, and test equipment where accuracy and thermal resilience are paramount. Engineers will appreciate its balance of performance and ease of integration in high-density PCBs.